At the SEMICON Taiwan 2024, Scott Huang, president of Chunghwa Precision Test (CHPT), a leading probe card manufacturer, remarked that the second half of 2024 is expected to outperform...
Merck continues to increase its investment in Taiwan, believing that essential materials are the most lacking element in Taiwan's AI industry supply chain and that it is well-positioned...
Broadcom business development manager for co-packaged optics (CPO) Tzu How Chow introduced and discussed various optical communications technologies during the Power and Opto Semiconductor...
Artificial Intelligence (AI) is boosting rapid advancements in data center construction but with increasingly massive power demands. Research institutions predict that energy consumption...
The US Department of Justice's antitrust probe against Nvidia came as no surprise. The chip vendor has made enormous profits since early 2023 with its stock price skyrocketing, thanks...
Provider of semiconductor materials such as silicon wafers, Shin-Etsu Chemical has many semiconductor material products ranked first or second in the market, but it is still concerned...
Six months ago, Intel CEO Pat Gelsinger introduced an ambitious "moonshot" initiative to match semiconductor manufacturing capacities in Europe and the US with those in Asia by 2030...
SEMICON Taiwan 2024, which kicked off on September 4, featured a MEMS & Sensors forum that focused on the future of AI. Industry leaders, including STMicroelectronics and Eminent...
During a recent public discussion with Imec CEO Luc Van den Hove, MediaTek CEO Rick Tsai highlighted that there are still technical barriers to AI chip development, such as chip interconnect...
The Indiana Economic Development Corporation (IEDC), the US state's leading economic development agency, has sent Secretary of Commerce David Rosenberg and an economic delegation...
With major IC design houses like Intel, Apple, and Qualcomm launching new products amid rising electronics demand, TSMC's 3nm capacity utilization has consistently stayed at 100%,...
At an event in Berlin on September 4, Intel introduced the Core Ultra 200V series processors, codenamed Lunar Lake. These new processors represent Intel's most efficient x86 architecture...
As advanced Chip-on-Wafer-on-Substrate (CoWoS) technology captures the spotlight in the semiconductor industry, fan-out panel-level packaging (FOPLP), another advanced packaging technique,...
