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TSMC on track to expand 2nm, advanced packaging fab capacities

Monica Chen, Hsinchu; Jessie Shen, DIGITIMES Asia Tuesday 4 February 2025 0

Credit: DIGITIMES

Despite the US's new tariff policy and other macroeconomic circumstances, TSMC is on track to boost its 2nm and advanced packaging fab capabilities in 2025, according to industry sources.

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