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Thursday 6 June 2024
Air Liquide plans US$250 million US location to supply Micron gas
Air Liquide has announced plans to construct a new industrial gas production facility in the US to serve Micron Technology's new fab. Under a long-term contract, the plant will produce...
Thursday 6 June 2024
WSTS raises global semiconductor market forecast for 2024 to 16% growth
The most recent forecast from World Semiconductor Trade Statistics (WSTS) indicates that the global semiconductor market is poised to enjoy robust growth in 2024 and 2025. WSTS also...
Thursday 6 June 2024
Renesas to help talent training in chip industry in India
According to Renesas' press release, on June 3, the Japan-based semiconductor solution provider and the Indian Institute of Technology Hyderabad (IITH) signed a three-year memorandum...
Thursday 6 June 2024
How hard to snatch 2nm foundry orders from TSMC?
Semiconductor foundry companies have started to compete in the 2nm process shortly after their 3nm production lines started humming to mass produce for customers. There is something...
Thursday 6 June 2024
Nvidia faces 50% foreign hiring mandate for potential new R&D center in Taiwan
If Nvidia decides to set up a second R&D center in Taiwan, the Ministry of Economic Affairs (MOEA) will require that 50% of the engineers be recruited from abroad, according to...
Thursday 6 June 2024
Imec, ASML open joint lithography lab
Imec and ASML have jointly announced the inauguration of a High NA EUV lithography lab in Veldhoven, the Netherlands. This lab is operated jointly by the two companies.
Thursday 6 June 2024
Phison expects enterprise SSD solutions revenue growth
Phison Electronics, which specializes in NAND flash device controllers and SSD solutions, has begun ramping up shipments of its retimer chips. The company also anticipates that the...
Thursday 6 June 2024
Taiwan's GenAI ecosystem unrivaled for next decade, says former tech minister
Taiwan boasts a comprehensive Generative AI (GenAI) ecosystem, with deep deployments in AI chips, packaging, and heat dissipation technologies, and no other place in the world is...
Thursday 6 June 2024
Who is the person behind Nvidia's next-gen platform 'Rubin'?
Nvidia CEO Jensen Huang surprised the audience by disclosing its next-generation platform's name "Rubin." Since Nvidia has been naming its products and platforms after famous scientists,...
Thursday 6 June 2024
Memory module manufacturers compete to ride AI growth wave; gather at Computex 2024 to showcase results
The memory industry is reaching new heights riding the AI wave.
Thursday 6 June 2024
TSMC reportedly to receive first high-NA EUV by end of 2024
Jefferies analysts revealed that ASML is expected to ship its high-NA EUV system to TSMC and expected the chipmaker to use the expensive machine in high-volume chip manufacturing...
Thursday 6 June 2024
TSMC to help VIS develop JV fab in Singapore, says VIS chair
Vanguard International Semiconductor (VIS) has reached an agreement with NXP Semiconductors to establish a 12-inch joint venture fab in Singapore, and the development of the JV fab...
Thursday 6 June 2024
NXP talks about ambitions for AI, responsible robots
During his keynote address on the second day of Computex 2024, Lars Reger, CTO of NXP Semiconductors, discussed the company's aspirations for AI and responsible robots by 2050.
Wednesday 5 June 2024
Micron has advantage in HBM4 orders for Nvidia's Rubin platform, said South Korean media
Nvidia CEO Jensen Huang disclosed that the next-generation Rubin platform will be equipped with 6th-gen high bandwidth memory - HBM4 at...
Wednesday 5 June 2024
NXP, VIS team up for 300nm JV fab in Singapore
NXP Semiconductors and Taiwan-based specialty IC foundry Vanguard International Semiconductor (VIS) have announced plans to create a manufacturing joint venture, VisionPower Semiconductor...