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NEWS TAGGED CHIPS + COMPONENTS
Friday 31 May 2024
Yageo eyeing transition into IDM
Yageo has been steadily evolving over the last 5-10 years, deliberately investing in new company groupings through M&A and private equity investments.
Friday 31 May 2024
Zhen Ding prepares for advanced developments, discusses AI server opportunities
Charles Shen, Chairperson of Zhen Ding, the major PCB company, stated that the first half of 2024, as in previous years, is the off-season for operations. However, compared to the...
Friday 31 May 2024
Chinese CIS suppliers expand presence in high-end smartphone market
The Chinese semiconductor industry, including the CMOS Image Sensor (CIS) segment, is finding more room for development in the domestic market with the sudden rise of the Chinese...
Friday 31 May 2024
New MediaTek flagship chipset to use Arm 3nm processor architecture
MediaTek has confirmed it will use Arm's all-new 3nm flagship Cortex-X925 CPU and Immortalis G925 GPU on its new Dimensity 9400 platform in the second half of 2024.
Friday 31 May 2024
Taiwan IC design firms may face pressure to attract talent
Taiwanese IC design houses may face talent poaching pressure from international tech firms that are expanding their R&D teams in Taiwan.
Thursday 30 May 2024
Samsung's new chip chief seeks to rally troops after setbacks
The new head of Samsung Electronics Co.'s semiconductor division urged employees to work their way past challenges in the business, making his first remarks to staff after the surprise...
Thursday 30 May 2024
Samsung boosts workforce at Japan R&D lab to drive chips packaging innovations
Samsung Electronics has recently expanded its workforce deployment at its new packaging R&D base in Yokohama, Japan, to expedite construction and support the development of next-generation...
Thursday 30 May 2024
Himax announces strategic investment in Obsidian Sensors
Himax Technologies has made a strategic investment in Obsidian Sensors, a thermal imaging sensor maker based in San Diego, according to the Taiwan-based IC design house.
Thursday 30 May 2024
Strong AI momentum expected to drive passive component demand
As demand for AI servers steadily grows, it directly drives the need for passive components.
Thursday 30 May 2024
HBM competition (1): advanced packaging technology divergence explained
High Bandwidth Memory (HBM) is a graphic memory with high bandwidth. Its main function is to support High-Performance Computing (HPC) or high-speed parallel computing with CPU/GPU...
Thursday 30 May 2024
Nanya expects return to profitability in 3Q24
DRAM chipmaker Nanya Technology is confident about achieving profitability in the third quarter of 2024.
Thursday 30 May 2024
Malaysia plots US$5.3 billion roadmap to build advanced chip ecosystem
Malaysian Prime Minister Anwar Ibrahim announced the National Semiconductor Strategy (NSS), with the government allocating MYR25 billion (US$5.3 billion) to foster industry develop...
Thursday 30 May 2024
Intel CEO to meet with key suppliers and partners in Taiwan
The list of companies attending Intel's gala dinner event, which will take place during CEO Pat Gelsinger's visit to Taiwan, has been leaked.
Thursday 30 May 2024
Apple iPhone order loss threatens Coherent's UK chip plant closure
US semiconductor manufacturer Coherent is facing the potential closure or sale of its 29,000-square-meter wafer fab in Newton Aycliffe, County Durham, UK.
Thursday 30 May 2024
Speculation grows about MediaTek gearing up for AI PCs
MediaTek's recent comment has fueled speculation that the Taiwanese IC design house may unveil a new Arm processor platform for AI PCs at the upcoming Computex next week.