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NEWS TAGGED 12-INCH WAFER
Friday 22 January 2010
Shanghai government to invest in new HHNEC-GSMC 12-inch fab
The Shanghai municipal government will invest 4.5 billion yuan (US$658.7 million) in a new 12-inch (300mm) wafer fab to be built by a joint venture of Hua Hong NEC (HHNEC) and Grace...
Monday 18 January 2010
Kinik obtains certification from TSMC for DDs used in 12-inch wafer CMP
Taiwan-based Kinik has secured certification from Taiwan Semiconductor Manufacturing Company (TSMC) for diamond disks (DDs) used in CMP (chemical-mechanical polishing) pad conditioning...
Tuesday 15 December 2009
TSMC to raise orders to testing partners, says paper
Taiwan Semiconductor Manufacturing Company (TSMC) plans to no longer add new capacity for wafer testing, and increase its outsourcing to backend partners Ardentec and STATS ChipPAC...
Friday 30 October 2009
Macronix net profits more than double in 3Q09
Mask ROM and NOR flash maker Macronix International Company (MXIC) saw its net profits increase 131% sequentially to NT$2.27 billion (US$69.63 million) in third-quarter 2009, according...
Wednesday 21 October 2009
PSC stands chance of turning a profit in 4Q09, says chairman
DRAM maker Powerchip Semiconductor Corporation (PSC) is likely to return to profit in the fourth quarter of 2009, if DRAM prices remain above US$2, according to company chairman Frank...
Friday 9 October 2009
UMC ramping 45/40nm at Fab 12i
United Microelectronics Corporation (UMC) has begun implementing a capacity expansion project for 45/40nm production at its Singapore-based 300mm (12-inch) wafer fab - Fab 12i, according...
Thursday 16 July 2009
Winbond remains cautious about expansion
Winbond Electronics, a Taiwan-based DRAM maker that has diversified its products to include niche memory and NOR flash, has said its capital spending for 2009 may be less than its...
Wednesday 15 July 2009
Elpida reportedly developing die-shrink 50nm process without expenditure on new tools
Elpida Memory has been quietly developing a technology based on its existing 65nm equipment for DRAM production, to enable a die shrink to 50nm, industry sources have claimed. The...
Tuesday 14 July 2009
Globalfoundries calls for renewed focus on 300mm
The semiconductor industry has long been preoccupied with smaller transistors and larger silicon wafers, in its effort to meet the ever-increasing demands of consumer technology....