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NEWS TAGGED 12-INCH WAFER
Monday 15 November 2010
Elpida approved to issue depositary receipts in Taiwan
Elpida Memory's planned TDR (Taiwan depositary receipt) issue has received approval from Taiwan's Industrial Development Bureau (IDB) under the Ministry of Economic Affairs (MOEA)...
Monday 15 November 2010
Taiwan to pass Japan as largest source of IC wafer fab capacity, says IC Insights
It was not long ago that Taiwan was considered just a provider of back-end (assembly and test) services for the semiconductor industry. However, over the past two decades the country...
Tuesday 5 October 2010
ChipMOS to expand into 12-inch gold bumping
Packaging and testing house ChipMOS Technologies (Bermuda) has revealed plans to add a new, 12-inch gold bumping production line in Taiwan with the installation set to complete by...
Thursday 30 September 2010
Shipments of semiconductor silicon to jump 23.6% in 2010, says iSuppli
Global silicon shipments in terms of square inches will rise to record levels in 2010, according to semiconductor manufacturing market research firm iSuppli. Shipments of silicon...
Friday 17 September 2010
TSMC to benefit most from IDM outsourcing, says Digitimes Research
With its lead in advanced process capacity, Taiwan Semiconductor Manufacturing Company (TSMC) is expected to be the largest beneficiary of increased outsourcing by IDMs, Nobunaga...
Friday 17 September 2010
Macronix signs NT$18 billion syndicated loan
NOR flash and mask ROM chipmaker Macronix International has obtained a syndicated loan worth NT$18 billion (US$564 million) from 15 banks, to fund the smooth operation of its new...
Monday 9 August 2010
Chipbond posts strong 2Q10 results; gives cautious outlook
Packaging and testing house Chipbond Technology has reported better-than-expected revenue and profit results for the second quarter of 2010, reflecting strong market demand for LCD...
Friday 16 July 2010
UMC to ramp up capacity of Singapore-based subsidiary
United Microelectronics Corporation (UMC) plans to ramp the capacity of its 12-inch fab in Singapore, UMCi, by 40,000 12-inch wafers, according to the company. UMCi currently rolls...
Thursday 8 July 2010
IC testing houses see record sales in June 2010
Sigurd Microelectronics and Ardentec have both reported record consolidated revenues for June, joining fellow King Yuan Electronics (KYEC) that saw its June sales reach an all-time...
Tuesday 6 July 2010
Powerchip revenues up in June, Nanya and Inotera down
Major Taiwan-based DRAM makers saw mixed revenues in June 2010 with mixed results, amid sluggish DRAM prices.
Friday 2 July 2010
Renesas raises outsourcing to Taiwan partners, says paper
Renesas Electronics has raised its orders to Powerchip Technology for its LCD driver ICs, and also grown its outsourcing to backend partner Chipbond Technology, according to a recent...
Monday 28 June 2010
Powerchip shifting product mix; approves NT$12.6 billion for 2010 capex
DRAM maker Powerchip Technology is looking to improve its competitive edge by adjusting its product mix and lowering production costs, according to the company. It has also budgeted...
Tuesday 15 June 2010
Nanya, Rexchip ahead of schedule on advanced processes
DRAM maker Nanya Technology has revealed plans to kick off pilot runs for 12-inch wafer production using a 42nm process in June. Peer Rexchip Electronics will also start deploying...
Wednesday 2 June 2010
DRAM and driver ICs buoying 12-inch wafer demand, says PSC president
Powerchip Semiconductor Corporation (PSC) is seeing tight capacity at its 12-inch fabs, buoyed by brisk demand for DRAM memory, according to company president Alex Wang. Meanwhile,...
Wednesday 26 May 2010
Silicon wafer prices could rise 15-30% in 3Q10
Semiconductor silicon wafer prices could see another 15-30% hike in the third quarter, after already rising 5% and 10-20% in the first and second quarters, respectively, according...