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NEWS TAGGED 12-INCH WAFER
Wednesday 19 July 2017
FD-SOI a promising technology: Q&A with Globalfoundries CEO Sanjay Jha
Globalfoundries' fully-depleted silicon-on-insulator FD-SOI process technology targeted at Internet of Things (IoT), artificial intelligence (AI) and Big Data applications has started...
Monday 10 July 2017
NSIG hires former MEMC CEO
China's National Silicon Industry Group (NSIG) has hired Nabeel Gareeb, former CEO of MEMC Electronic Materials, to help it establish a materials eco-system in China.
Monday 10 July 2017
Globalfoundries 22FDX attracts orders from Shanghai Fudan
Globalfoundries' 22nm FD-SOI process, dubbed 22FDX, has obtained orders from Shanghai Fudan Microelectronics, according to industry sources.
Thursday 29 June 2017
Powerchip eyeing orders from Illumina
Powerchip Technology is looking to become the second foundry partner of Illumina following Taiwan Semiconductor Manufacturing Company (TSMC), according to industry sources.
Wednesday 28 June 2017
Winbond intros 1.2V, 1.5V NOR flash memories for IoT
Winbond Electronics has announced an expansion of its flash product portfolio with the introduction of its lowest-voltage SpiFlash memories to date. At 1.2 and 1.5V, and in 8-pin...
Tuesday 20 June 2017
GlobalWafers teaming up with Ferrotec to expand 8-inch wafer supply
Taiwan-based GlobalWafers is teaming up with Ferrotec to ramp up new 8-inch wafer capacity, according to company chairperson Doris Hsu.
Wednesday 14 June 2017
Winbond to expand 12-inch fab capacity
Winbond Electronics plans to expand its 12-inch fab capacity to 48,000 wafers per month by the end of 2017 from the current 44,000 units, according to the memory maker. The monthly...
Wednesday 24 May 2017
Hefei Chang Xin keeps low profile but DRAM ambition remains unchanged
Hefei Chang Xin's ambition to grow its DRAM business has seen some progress though the China-based firm has now chosen to keep a low profile. The company has been quietly renamed...
Tuesday 2 May 2017
Winbond planning new 12-inch fab
Specialty DRAM and NOR flash memory maker Winbond Electronics is planning a new 12-inch wafer plant which will be located in Tainan, southern Taiwan or Singapore.
Thursday 27 April 2017
UMC expects flat performance in 2Q17
United Microelectronics (UMC) expects its wafer shipments and ASPs to stay flat sequentially in the second quarter of 2017, when the foundry chipmaker's capacity utilization rate...
Monday 17 April 2017
UMC Xiamen fab obtains orders from MediaTek, Spreadtrum
United Microelectronics' (UMC) recently-opened 12-inch wafer fab in Xiamen, China has obtained 40nm chip orders from MediaTek and Spreadtrum Communications, according to industry...
Friday 24 February 2017
Winbond mulls opening 12-inch wafer fab in Singapore, says report
Winbond Electronics has been approached by the Singapore government to set up a manufacturing site locally, and the Taiwan-based maker of specialty DRAM and flash memory is considering...
Monday 13 February 2017
Globalfoundries Chengdu fab to start production in 4Q18
Globalfoundries' plan to construct a new 300mm wafer fab in Chengdu, China to satisfy demand for the foundry's 22FDX technology is well on track, with production at the facility set...
Friday 16 December 2016
Faraday announces 55nm eFlash-based ASIC solution
Faraday Technology has announced its 55nm eFlash-based ASIC solution is ready to support better MCU performance, and has already achieved multiple design wins for products such as...
Tuesday 13 December 2016
Commentary: Silicon wafer industry headed for consolidation
With Siltronic reportedly drawing interest from China's state-backed industry group, the global silicon wafer industry is expected to go through a period of consolidation in 2017.