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NEWS TAGGED 12-INCH WAFER
Monday 25 September 2017
Beijing, Shanghai IC sectors prospering
The flourishing IC industries in Beijing and Shanghai has been pushing forward China's overall IC industry development, enabling the rapid rise of China in the global marketplace...
Friday 22 September 2017
Globalfoundries Chengdu fab nears completion
Global foundries will hold a "topping out" ceremony to celebrate a major milestone of the construction of its new 12-inch wafer plant in Chengdu, China at the end of October, according...
Friday 22 September 2017
Supply of 12-inch silicon wafers to stay tight through 2019
The global supply of 12-inch silicon wafers will further tighten over the next two years, when new fabs in China are set to come online, according to industry sources.
Thursday 21 September 2017
DRAM bit growth to reach 19.6% in 2018, says DRAMeXchange
Global DRAM bit production will grow just 19.6% in 2018, as major suppliers intend to slow down the pace of their capacity expansions and technology migrations for chip price stability,...
Monday 18 September 2017
SJSemi, Qualcomm announce qualification of 10nm ultra-high density wafer bumping technology
China-based SJ Semiconductor has started the qualification of 10nm ultra-high density wafer bumping for Qualcomm, according to the companies. This represents SJSemi's further improvement...
Wednesday 13 September 2017
TSMC starts equipment move-in at Nanjing plant
TSMC on September 12 held a ceremony to mark the start of equipment move-in at its new 12-inch wafer plant in Nanjing, China.
Wednesday 30 August 2017
GigaDevice draws investment from China state-backed fund
China-based GigaDevice Semiconductor has obtained investment from China's National IC Industry Investment Fund, commonly known as the Big Fund, according to the maker of flash memory...
Thursday 24 August 2017
ASML opens branch office in Nanjing
ASML has announced the opening of a new branch office in Nanjing, China where its major client TSMC is constructing a new 12-inch wafer plant.
Wednesday 23 August 2017
Winbond announces equipment purchases
Winbond Electronics, a memory chipmaker specializing in specialty DRAM and flash memory chips, has disclosed two purchases of machinery equipment from Lam Research and Tokyo Electron...
Friday 18 August 2017
Wafer Works expects wafer prices to continue rising on strong demand
Taiwan-based Wafer Works, which makes small- to medium-size semiconductor-grade wafers, expects silicon wafer prices to continue rising on strong demand.
Friday 11 August 2017
Shanghai Huahong renames fabs
Shanghai Huahong Group has renamed all the wafer fabs under the group. The move is to enhance the overall image of the group's IC manufacturing business, and enable its worldwide...
Friday 11 August 2017
NVM IP provider eMemory optimistic about 2H17
Taiwan-based eMemory, a developer and provider of embedded non-volatile memory (eNVM) technology, expects sales to peak for 2017 in the second half of the year thanks to robust demand...
Thursday 3 August 2017
Commentary: Can Samsung Foundry unseat TSMC?
Samsung Foundry has unveiled an aggressive sub-10nm roadmap that scales down to 4nm, and claimed it is looking to unseat United Microelectronics (UMC) as the world's second-largest...
Wednesday 2 August 2017
Shanghai Huahong to build 12-inch fab in Wuxi
Shanghai Huahong Group on August 2 struck a deal with the national China Integrated Circuit Industry Investment Fund and the city government of Wuxi to set up a new 12-inch wafer...
Thursday 27 July 2017
Winbond to spend NT$6.28 billion on equipment
Taiwan-based Winbond Electronics, a provider of specialty DRAM and flash memory, has announced plans to budget an additional capex of NT$6.28 billion (US$207.7 million) for buying...