CONNECT WITH US
NEWS TAGGED 12-INCH WAFER
Tuesday 15 May 2018
Bitmain reportedly places DRAM orders with ESMT, Etron
Bitmain has reportedly placed DRAM orders mainly for low-capacity DDR3 chips with Taiwan-based memory design specialists Elite Semiconductor Memory Technology (ESMT) and Etron Technology,...
Friday 11 May 2018
Powerchip to build new 12-inch wafer fab
Foundry chipmaker Powerchip Technology plans to build a new 12-inch wafer plant in the Tongluo campus of Hsinchu Science Park (HSP) in Miaoli, northern Taiwan with total investment...
Friday 4 May 2018
Foxconn mulls 12-inch fab construction
Foxconn Electronics (Hon Hai Precision Industry) has set up a semiconductor subgroup, which is mulling 12-inch fab construction, industry sources have claimed.
Thursday 19 April 2018
GlobalWafers to expand 12-inch wafer production at Korea plant, report says
Silicon wafer company GlobalWafers has struck a deal with a provincial government in South Korea for expansion of its local plant in Cheonan, South Chungcheong, according to a report...
Thursday 19 April 2018
SPIL Jinjiang plant to start generating revenues in 1Q19
IC packager Siliconware Precision Industries' (SPIL) Jinjiang plant in Fujian, China will initially focus on providing backend services for DRAM memory, and will start generating...
Wednesday 18 April 2018
Clean room specialist Acter enjoys clear order visibility through 1H19
Taiwan's clean room engineering specialist Acter has reported clear order visibility through the first half of 2019 thanks to robust demand from overseas semiconductor firms and LCD...
Tuesday 17 April 2018
Innotron Memory gearing up for DDR4 chip production, says CEO
China-based Innotron Memory, previously known as Hefei ChangXin or Hefei RuiLi, is gearing up for volume production of 8Gb DDR4 chips in 2019.
Tuesday 10 April 2018
Micron to expand NAND flash site in Singapore
Micron Technology is adding a new facility to its existing 12-inch wafer plant for the manufacture of NAND flash memory in Singapore. The new facility is expected to come online by...
Tuesday 3 April 2018
TSMC advanced packaging seen crucial for HPC chips
The InFO WLP (integrated fan-out wafer level packaging) and CoWoS (chip on wafer on substrate) developed by Taiwan Semiconductor Manufacturing Company (TSMC) have emerged as two major...
Wednesday 28 March 2018
New packaging tech FOPLP rising to spur demand for advanced equipment
Major IC packaging and testing players are actively developing an advanced fan-out panel level packaging (FOPLP) technology that can package chips on panels larger than 8-inch or...
Monday 19 March 2018
China wafer fabs can thrive on strong domestic demand, says Gudeng chairman
Bolstered by China's large population, solid mobile network infrastructures, and aggressive deployments in IoT and AI applications, the localization of its semiconductor industry...
Thursday 18 January 2018
IC analyzers iST, MA-tek to see revenues soar in 2018
Taiwan's dedicated semiconductor materials analysis and IC debugging services providers, Integrated Service Technology (iST) and Materials Analysis Technology (MA-tek), have reported...
Monday 18 December 2017
Globalfoundries charts 2-pronged approach for FD-SOI process
Globalfoundries (GF) will have its 12-inch wafer fabs in Dresden, Germany focus on using FD-SOI (fully-depleted silicon-on-insulator) process technology to fabricate automotive-use...
Tuesday 12 December 2017
Taiwan IC materials suppliers expect better revenue records in 2018
Taiwan's major semiconductor materials distributors such as Topco Scientific and Wah Lee Industrial have reported revenue increases in the first 11 months of 2017 and expect better...
Friday 8 December 2017
TSMC Nanjing fab to start volume production in May 2018
Taiwan Semiconductor Manufacturing Company (TSMC) will see its 12-inch wafer fab in Nanjing, China start volume production in May 2018, more than one quarter ahead of its original...