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NEWS TAGGED 12-INCH
Tuesday 21 April 2009
Semiconductor equipment makers wary of 450mm development, says The Information Network
The planned transition to 450mm diameter silicon wafers for semiconductor production will be disastrous for the equipment industry, The Information Network said.
Monday 20 April 2009
IM Flash likely to beat Hynix in 2009 ranking, says DRAMeXchange
IM Flash Technologies, a joint venture between Intel and Micron Technology, may overtake Hynix Semiconductor and become the third-largest NAND flash supplier worldwide in 2009, according...
Monday 13 April 2009
Integrated handheld solutions driving demand for wafer-level packaging, says ASE
Handheld devices incorporating functionality such as Bluetooth, FM radio, GPS and Wi-Fi have become the market driver for wafer-level packaging (WLP), Taiwan's Advanced Semiconductor...
Monday 13 April 2009
TSMC speeds up 12-inch fab expansion
Taiwan Semiconductor Manufacturing Company (TSMC) has completed fourth-phase expansion to its 12-inch facility, Fab 12, at the Hsinchu Science Park (HSP), where production at the...
Wednesday 1 April 2009
TSMC and PSC deny equipment purchase rumors
Taiwan Semiconductor Manufacturing Company (TSMC) and Powerchip Semiconductor Corporation (PSC) have dismissed recent rumors that the DRAM maker intends to sell its equipment to the...
Monday 23 March 2009
TSMC resumes production as orders surge
Taiwan Semiconductor Manufacturing Company (TSMC) has returned to almost full production, buoyed by a surge in short lead time orders for handset chips, telecom products and graphics...
Monday 23 March 2009
DRAM chipmakers Nanya and Inotera gain capital support from Formosa Plastics
Taiwan's Nanya Technology and Inotera Memories have received additional capital of over NT$10 billion (US$296 million) from parent company the Formosa Plastics Group, according to...
Friday 20 March 2009
ProMOS responds to production halt rumors
ProMOS Technologies has responded to a Chinese-language Economic Daily News (EDN) report which claimed the DRAM maker intends to halt production at its 12-inch fabs in Hsinchu,...
Wednesday 18 March 2009
FlipChip announces 300mm strategic partnership with SMIC
FlipChip International (FCI), which specializes in flip-chip bumping and wafer level packaging, has recently announced a partnership alliance with Semiconductor Manufacturing International...
Wednesday 18 February 2009
Lenovo adopts Nvidia Ion platform for over-10-inch netbooks, says paper
Lenovo plans to launch 11.6-inch and 12.1-inch netbooks combining Intel's Atom processor and Nvidia's Ion platform in the second quarter of this year, according to a Chinese-language...
Monday 16 February 2009
Lenovo to launch 12-inch Atom netbook
Lenovo reportedly plans to launch an Atom N280-based IdeaPad S20 netbook featuring a 12-inch panel. The specification would break Intel's restrictions for netbook products that state...
Monday 9 February 2009
Silicon wafer ASPs fall 20% in 1Q09, says paper
The ASP of 12-inch silicon wafers has slid by 20% sequentially in the first quarter of 2009, in line with utilization drops at Taiwan Semiconductor Manufacturing Company (TSMC) and...
Friday 16 January 2009
TSMC to buy ProMOS 12-inch equipment
ProMOS Technologies has decided to sell its 12-inch foundry equipment in the Central Taiwan Science Park for NT$580 million (US$17.39 million), and Taiwan Semiconductor Manufacturing...
Wednesday 10 December 2008
ProMOS to sell 12-inch equipment; phasing out 8-inch production
ProMOS Technologies plans to sell part of the machinery equipment located at its 12-inch fabs. The company also announced plans to gradually phase out of commodity DRAM production...
Friday 5 December 2008
DRAM maker ProMOS denies suspension of 12-inch fab in HSP
Taiwan-based DRAM maker ProMOS Technologies has denied a media report stating that the company's 8- and 12-inch fabs in the Hsinchu SciencePark (HSP) have been forced to suspend operations...