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NEWS TAGGED WINBOND
Monday 4 August 2008
Winbond plans to raise bank loan; preps introduction of buried Wordline by 2009
Despite still languishing in red in the second quarter of 2008, Winbond Electronics plans to raise a NT$5 billion (US$162.9 million) loan to fund operations. The company is also preparing...
Wednesday 4 June 2008
Winbond secures NT$7.7 billion loan
Winbond Electronics announced that it has signed a NT$7.7 billion (US$254 million) five-year syndicated loan agreement to fund its expansion plan and technology upgrade of its 12-inch...
Vortex
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research