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NEWS TAGGED WINBOND
Monday 4 August 2008
Winbond plans to raise bank loan; preps introduction of buried Wordline by 2009
Despite still languishing in red in the second quarter of 2008, Winbond Electronics plans to raise a NT$5 billion (US$162.9 million) loan to fund operations. The company is also preparing...
Wednesday 4 June 2008
Winbond secures NT$7.7 billion loan
Winbond Electronics announced that it has signed a NT$7.7 billion (US$254 million) five-year syndicated loan agreement to fund its expansion plan and technology upgrade of its 12-inch...
Research Report Database
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research