Major US cloud service providers (CSP) are moving to postpone or adjust their datacenter expansion projects, while enterprises and telecom operators also continue capex cuts, clouding...
Taiwan-based Xintec, a WLCSP (wafer level chip scale package) specialist under TSMC, has approved a capital expense of NT$2.5 billion (US$83.33 million) to expand capacity at existing...
Semiconductor material distributors are optimistic about demand from the server sector in 2022, particularly from US cloud service platforms (CSP) operators Google, Meta, Microsoft...
Datacenters are opening at a rapid pace in ASEAN countries. Amazon Web Services (AWS) is building new data centers in Jakarta, Indonesia; Microsoft has plans to set up Azure datacenters...
China's National Semiconductor Industry Investment Fund (aka the Big Fund) continues to pour money into China's domestic fab toolmakers, looking to rev up the development of China's...
Pure-play foundry United Microelectronics (UMC) has announced plans to form a strategic partnership with Chipbond Technology, a display driver IC (DDI) backend specialist, through...
MCU specialist Nuvoton Technology has seen the synergies from its 2019 acquisition of Panasonic Semiconductor Solutions (PSCS) start paying off, given its sharp revenue and profit...
Orient Semiconductor Electronics (OSE) is looking to scale up its EMS business beyond the electronics sector, while strengthening its collaboration with backend house Chipbond Technology...
Taiwan-based Powertech Technology (PTI) is one of the world's top OSATs with major backend orders from non-Korean memory vendors. PTI has just completed a top management shakeup after...
Harvatek Corporation has introduced a new LED product in chip scale package (CSP). This LED has high brightness with low power dissipation and there are no wire bonding which reduces...
Unimicron Technology's IC substrate plant in Taoyuan, northern Taiwan caught fire on the afternoon of October 28. The site is where the company produces flip-chip chip-scale packaging...
ASE Technology has broken ground for a new smart plant in Kaohsiung, southern Taiwan to be dedicated to advanced packaging processes, with annual production estimated at US$500 million...
China-based CIS (CMOS image sensor) packaging service provider China Wafer Level CSP has posted consolidated revenues of CNY191 million (US$27.4 million) and net profit of CNY62 million...
CMOS image sensor (CIS) backend specialists including Tong Hsing Electronic Industries and Xintec are expanding capacity seeking to satisfy growing demand for multi-lens camera pho...
IC substrates are set to enter a golden growth period driven by ever-increasing applications of 5G and AI chips solutions. To secure a preemptive presence in the market, Taiwan's...
