PCB and IC substrate supplier Unimicron Technology has decided to increase its capex budget this year by NT$2.32 billion (US$75.5 million) to total NT$8.3 billion, according to a...
Taiwan-based IC packager Xintec is expected to enjoy significant 3D sensing business opportunities from both iPhone and Android-based smartphone camps in 2018 in its capacity as a...
As demand for LED end devices has resumed growth amid shortages of LED chip supply, China's LED makers have recently begun expanding their capacities and local governments are also...
LED epiwafer and chip maker Epistar expects shipments of CSP (chip-scale packaging) LED chips for LCD TV backlighting to increase beginning third-quarter 2017, according to the com...
Taiwan's Xintec, an affiliate of Taiwan Semiconductor Manufacturing Company (TSMC) specializing in packaging services for CMOS image sensors as well as MEMS and fingerprint sensors,...
Logic IC packaging firm Greatek Electronics will start production for bumping and wafer-level CSP in July 2017 which will further buoy its sales performance for the year, according...
Genesis Photonics has been making efforts to promote FC CSP (flip chip chip scale packaging) for automotive headlights in a bid to bounce back from eight consecutive quarters of net...
LED epitaxial wafer and chip maker Epistar, in view of fast growing demand for CSP (chip scale package) LED chips used in TV backlighting, will expand production capacity to four...
At the Lighting Japan 2016 exhibition in Tokyo during January 13-15, CSP (chip scale package) LEDs were a major focus. There were CSP LEDs developed by Japan-based GeneLite for smartphone...
LED epitaxial wafer and chip maker Genesis Photonics has begun to ship CSP of (chip scale package) of chips for use in automotive headlights, backlighting of LCD TVs and camera flashes,...
Taiwan's Xintec, an affiliate of Taiwan Semiconductor Manufacturing Company (TSMC) specializing in packaging services for CMOS image sensors as well as MEMS and fingerprint sensors,...
Altera and TSMC have produced an UBM-free (under-bump metallization-free) WLCSP (wafer-level chip scale package) technology for Altera's MAX 10 FPGA products, according to the comp...
Image sensor packaging house Xintec will have its 12-inch wafer-level chip-scale package (WL-CSP) line ready for volume production in the second half of 2015, according to company...
Taiwan-based IC substrate makers Unimicron Technology, Kinsus Interconnect Technology and Nanya PCB will continue to ramp up their production capacities for flip-chip chip scale package...
IC packaging material and tool distributor Niching Industrial looks to ramp up its shipments of EMC-based (epoxy molding compound) LED leadframes and FC CSP substrates to drive revenue...
