Siliconware Precision Industries (SPIL), in view of fast growing demand for ICs used in smartphones, is setting up FC (flip chip) CSP (chip scale package) capacity at its two factories...
IC substrate makers Kinsus Interconnect Technology, Unimicron Technology and Nanya PCB all plan to ramp up their production capacity for flip-chip chip scale package (FC CSP) substrates...
Nan Ya PCB (NPC) will invest most of its targeted capex of NT$2 billion (US$67 million) on FC CSP (chip scale package) substrates in 2013, acknowledging brisk demand coming from the...
Can photoimageable coverlay (PIC) be adopted for chip scale package (CSP) process, replacing the commonly used dry film to solve the problem of a multilayer chip's insulation layer...
Kinsus Interconnect Technology will perform relatively strongly in the first quarter of 2013, buoyed by shipments of FC CSP (flip-chip chip-scale package) substrates to clients including...
The supply of a chemical raw materials for producing ink used in the production of FC CSP (flip chip-chip scale package) substrates may be affected after a recent explosion and fire...
Kinsus Interconnect Technology has entered the supply chain of Apple's iPhone 5 and is expected to see robust shipments of its FC CSP (chip scale package) substrates for Qualcomm's...
Shipments of flip-chip chip-scale package (FC CSP) substrates for Apple's A5 processors from Taiwan-based Kinsus Interconnect Technology are expected to top one million units a month...
Unimicron Technology will soon begin to ship its FC CSP (flip-chip chip-scale-packaging) substrates to Texas Instruments (TI) for the production of ARM-based OMAP3 CPU lineups, according...
IC substrate maker Kinsus Interconnect Technology has landed orders for FC CSP (flip-chip chip-scale packaging) substrates from Intel, according to a Chinese-language Commercial...
Taiwan-based IC substrate maker Kinsus Interconnect Technology revealed that construction of a new plant in Suzhou, China is near completion, and production will kick off in the fourth...
IC substrate maker Kinsus Interconnect Technology expects its revenues to grow 5-10% sequentially in the third quarter with flip-chip chip-scale packaging (FC CSP) and base station...
Nan Ya Printed Circuit Board (NPC) may see its revenues from flip-chip chip scale packaging (FC CSP) substrates double in 2010 because of significant demand from the handset segment,...
Taiwan-based IC substrate maker Kinsus Interconnect Technology has seen its capacity utilization for flip-chip chip scale packaging (FC CSP) substrates rise to more than 80% and the...
Kinsus Interconnect Technology is expected to manage sequential revenue growth from July through December 2009, driven by growing sales of its high-margin product lines, according...
