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Thursday 9 March 2017
ShunSin posts EPS of NT$9.12 for 2016
ShunSin Technology, a subsidiary of Foxconn Electronics (Hon Hai Precision Industry) specializing in assembly and test of system-in-package (SiP) modules, has announced net profits...
Thursday 16 February 2017
SiP module supplier ShunSin to roll out more fingerprint sensor, telematics modules in 2017
ShunSin Technology, a subsidiary of Foxconn Electronics specializing in assembly and test of system-in-package (SiP) modules, plans to focus more on fingerprint sensor and telematics...
Tuesday 27 December 2016
ASE obtains ISO 26262 for its Kaohsiung site
Advanced Semiconductor Engineering (ASE) has obtained the ISO 26262 certification from TUV Nord for its Kaohsiung, southern Taiwan facility, according to the packaging and testing...
Friday 11 November 2016
Advantest launches Versatile T2000 AiR System for low-volume testing of highly integrated modules and system-in-package (SiP) devices
Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) has begun taking orders for its new T2000 AiR system, a compact, air-cooled system optimized for low-cost...
Tuesday 8 November 2016
ShunSin nets NT$6.72 per share for 1Q-3Q16
ShunSin Technology, a subsidiary of Foxconn Electronics (Hon Hai Precision Industry) specializing in assembly and test of system-in-package (SiP) modules, has announced net profits...
Tuesday 11 October 2016
ASE reports flat 3Q16 revenues
Advanced Semiconductor Engineering (ASE) saw its consolidated revenues dip 0.1% from a year earlier in the third quarter of 2016, while sales generated from its core IC ATM (assembly...
Friday 7 October 2016
ASE breaks ground for new factory building in Kaohsiung
Advanced Semiconductor Engineering (ASE), a provider of semiconductor assembly and test services, has announced that it has held a groundbreaking ceremony at the site of its K24 building...
Tuesday 27 September 2016
Foxconn could expand SiP business with Sharp chip unit
Foxconn Electronics (Hon Hai Precision Industry) is in the process of integrating Sharp into its group, including Sharp's chip unit, which is a difficult part to combine with. Nevertheless,...
Tuesday 20 September 2016
ASE a major SiP backend provider for Apple, say sources
Advanced Semiconductor Engineering (ASE), through its Shanghai-based subsidiary Universal Scientific Industrial (USI), has obtained SiP (system-in-package) backend orders for Wi-Fi,...
Tuesday 13 September 2016
Introducing the world's smallest LoRa+MCU solution with the utilization of SiP process
The world's first SiP (System in Package) processed LoRa+MCU solution is presented today through the extraordinary collaboration between the world-leading Internet of Things solution...
Wednesday 7 September 2016
ASE optimistic about SiP, demand for mid- and high-end smartphones
Chip demand for mid- and high-end smartphones is set to be higher than expected in 2016, while demand for SiP (system-in-package) remains robust, according to Advanced Semiconductor...
Tuesday 16 August 2016
ShunSin posts profit growth in 2Q16
ShunSin Technology, a subsidiary of Foxconn Electronics (Hon Hai Precision Industry) specializing in assembly and testing system-in-package (SiP) modules, saw its net profits surge...
Friday 8 July 2016
ASE posts flat 2Q16 revenues
Advanced Semiconductor Engineering (ASE) saw its consolidated revenues increase only 0.4% sequentially in the second quarter of 2016, while sales generated from its core IC ATM (assembly...
Tuesday 28 June 2016
ASE seeing better sales in 2H16
Advanced Semiconductor Engineering (ASE) expects to post sequential revenue growth through the fourth quarter of 2016, according to company COO Tien Wu. Revenues for the second half...
Tuesday 31 May 2016
Computex 2016: ASE to showcase SiP, MEMS and sensor solutions for smart living applications
Advanced Semiconductor Engineering (ASE) has announced that it will showcase system-in-package (SiP), MEMS and sensor technologies through live demonstrations of smart living and...