Advanced Semiconductor Engineering (ASE) and Cadence Design Systems have collaborated to release a system-in-package (SiP) EDA solution that addresses the challenges of designing...
High performance computing (HPC) will become the most crucial platform in the development of process technologies for AI (artificial intelligence) chips, and CoWoS (chip on wafer...
Networking device supplier Gemtek Technology plans to fully acquire SiP module maker Ampak Technology to enhance its presence in the IoT and cloud-enabled communication market.
Shipments of Apple Watch 3 are expected to surge 20% on year to reach 23-25 million units in the coming year, which will greatly benefit Taiwan players in the supply, particularly...
Robust demand for flash memory chips will buoy further sales performance at Powertech Technology (PTI) in the fourth quarter of 2017, said the memory backend specialist at an October...
Quanta Computer, Inventec as well as the ASE group's Universal Scientific Industrial (USI) and the Foxconn group's Shunsin Technology and Luxshare-ICT, are expected to see strong...
ShunSin Technology, a subsidiary of Foxconn Electronics (Hon Hai Precision Industry) specializing in assembly and test of system-in-package (SiP) modules, has obtained new orders...
AMD's new Radeon RX Vega series graphics cards, which have become available since August 15, are currently seeing tight supply in the retail channel reportedly due to an insufficient...
Siliconware Precision Industries (SPIL) has announced plans to invest indirectly a total of US$25 million in its newly-established wholly-owned subsidiary in China. Named Siliconware...
Memory backend specialist Powertech Technology (PTI) expects its sales to peak in the third quarter, and remains optimistic about the outlook for the fourth quarter.
Specializing in smartphone SoC chips, MediaTek has been aggressively developing its highly-integrated SoC offerings for wearable and IoT applications. With its IoT solutions, MediaTek...
China-based Tongfu Microelectronics has struck a deal with the Xiamen Haicang District government to set up a manufacturing base for advanced packaging and testing services locally...
Semiconductor Manufacturing International's (SMIC) 28nm HKMG process has entered its mass production stage, according to company CEO Haijun Zhao. SMIC will move forward making chips...
Universal Scientific Industrial (Shanghai) Co., Ltd., (SSE 601231), a leading global company in electronic design and manufacturing, is going to launch WM-BAC-CYW-33 SiP (System in...
ShunSin Technology, a subsidiary of Foxconn Electronics (Hon Hai Precision Industry) specializing in assembly and test of system-in-package (SiP) modules, has announced net profits...
