Backend house ASE Technology Holding has offered a development board based on its system-in-package (SiP) services for heterogeneous SoC chips designed for true wireless stereo (TWS)...
Backend service leader ASE Technology Holding plans to set up 15 lights-out fabs by the end of 2020 as part of its efforts to strengthen smart production capability to support high-end...
The global semiconductor sector will experience constant quantitative and qualitative changes in the next 20-30 years, and heterogeneous integration will not be confined to CPU and...
Leading IC backend house ASE Technology Holding will have its fan-out (FO) packaging technology ready in 2020 at the earliest for volume production of mmWave antenna-in-package (AiP)...
IC backend house ASE Technology Holding is expected to generate sequential revenue increases through the last quarter of 2019, driven by orders for SoC chips for smartphones, wearables...
ABF substrates have seen robust demand for processing 5G networking chips and high-performance computing chips since the start of 2019, but shipments of BT substrates for mobile chips...
ShunSin Technology, Foxconn Technology Group's IC backend service affiliate, is expected to see revenues and profits hit the year's highs in September and October, bolstered by robust...
Taiwan's top backend house Advanced Semiconductor Engineering (ASE) has decided to purchase a new factory building in Kaohsiung, southern Taiwan to provide more space for warehousing...
With Qualcomm aggressively offering multiple APs, baseband chips and RF front-end modules (FEMs) to tap the 5G smartphone market, its Taiwan-based backend service providers including...
MediaTek has placed backend orders with Amkor Technology for its new 7nm SoC designed for low-band (sub-6GHz) 5G handsets, according to industry sources.
Taiwan's top IC backend specialist ASE Technology Holding has seen its SiP (system in package) business expand substantially so far this year amid growing demand for heterogeneous...
As shipments of 5G network equipment and terminal devices are set to trend up steadily, major global chipmakers are all gearing up for close combats in the 5G chipset market by releasing...
Taiwan's makers of ABF-based IC substrates including Unimicron and Nan Ya PCB will see full capacity utilization for the product line through the second half of 2019 mainly thanks...
Clear order visibility for diverse IC packaging materials is seen through the end of the third quarter of the year thanks mainly to increasingly robust demand from OSAT (outsourced...
Backend house ShunSin Technology, a subsidiary of Foxconn Electronics (Hon Hai Precision Industry) specializing in system-in-package (SiP) modules, expects new orders for facial recognition...
