Universal Scientific Industrial (USI), an affiliated company of Advanced Semiconductor Engineering (ASE), reportedly has landed SiP module orders from Apple for its iWatch wearable...
Advanced Semiconductor Engineering (ASE), the world's largest chip packaging and testing company, expects its first-quarter shipments to decrease 12-15% sequentially due to seasonal...
SiP (system-in-package) currently accounts for 5-10% of the overall production value of the IC packaging sector, according to Tien Wu, COO for Advanced Semiconductor Engineering (ASE)...
Consolidated revenues at Advanced Semiconductor Engineering (ASE) climbed to an all-time high of NT$20.76 billion (US$707 million) in October 2013, representing growth of 17.7% on...
ChipSiP Technology, which provides turnkey system-in-package (SiP) solutions, has launched what the company claims is the world's first HD resolution near-eye display on the Android...
Sales of Advanced Semiconductor Engineering's (ASE) core IC ATM (assembly test and material) business is likely to post a sequential decrease in the fourth quarter of 2013, due to...
Out of every 6-7 system-in-package (SiP) devices, one is produced by Advanced Semiconductor Engineering (ASE), according to Ho-Ming Tong, company chief R&D officer. With its complete...
IC packaging and testing house Advanced Semiconductor Engineering (ASE) is expected to secure backend orders for fingerprint sensors, application processors and Wi-Fi modules for...
The development of System on Chip (SoC) technology has increased significantly due to the increasing demands of lower power and smaller form factors in mobile devices, which are gaining...
AzureWave Technologies, a Taiwan-based provider of wireless networking and image processing solutions, expects demand for WLAN SiP (system in package) modules to increase in 2013,...
Imagination Technologies, a leading multimedia and communications technologies company, observes that the growth in performance of mobile GPUs, such as its PowerVR IP cores, is driving...
MediaTek has taken up a 10.2% stake in wireless SiP module maker AcSiP Technology through a private placement, according to a Chinese-language Economic Daily News (EDN)...
AcSiP Technology, a Taiwan-based maker of wireless SiP (system in package) modules used in smartphones, has developed modules for tablet PCs and other terminal devices and will begin...
COB (chip on board) used to be the mainstream solution for WLAN chips in smartphones, but has been replaced by SiP (system in package) for two years. However, the adoption of COB...
AzureWave Technologies, a Taiwan-based provider of wireless networking and image processing solutions, has seen increasing shipments of Wi-Fi SiP (system in package) modules built...
