Alkaidsemi (Shanghai) Technologies Corporation has introduced a 1,200 V silicon carbide superjunction MOSFET that it describes as the world's first SiC superjunction MOSFET product. Project leader Hao Yue said it is among the first globally to complete product validation, positioning the company for emerging demand from AI server power supplies and high-voltage direct-current data center architectures.
Samsung Electro-Mechanics (Semco) is facing a slower glass-substrate rollout as a reliability evaluation of through-glass via (TGV) modules submitted to TSMC takes longer than expected, pushing back related equipment orders and adding pressure to a commercialization schedule that had already shifted into 2028.
LG Innotek is applying internally developed artificial intelligence to semiconductor glass substrate manufacturing, targeting microcracks, one of the technology's toughest yield challenges. The move comes as industry forecasts and supplier roadmaps increasingly point to around 2028 as an early window for initial glass-core substrate production.
WG Tech (Jiangxi) Group is accelerating its shift from display glass into semiconductor applications, targeting through-glass via (TGV) substrates for optical communications and advanced packaging as AI demand expands.
