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Wednesday 10 June 2026

GEM Terminals cites AI-driven demand as May 2026 copper sales jump 72%

GEM Terminals reported consolidated revenue of about NT$428 million (US$13.6 million) in May 2026, up 71.83% year-over-year from NT$249 million, saying expanding global investment in AI infrastructure drove a surge in demand for specialty copper materials used in cooling applications. The firm linked the month's performance to rising cooling needs at servers and data centers as computing density increased, and described the result as evidence of strong long-term momentum for its materials transformation strategy.

Wednesday 10 June 2026

Posiflex sees orders through 3Q26, shuns price war

Posiflex said order visibility for the second and third quarters of 2026 remains relatively clear, though the industrial PC and POS hardware supplier is taking a cautious view of the fourth quarter as component supply, geopolitical risks, and broader market conditions remain uncertain.

Wednesday 10 June 2026

AI use in PCB manufacturing has gone mainstream, but scaling remains lagging

AI adoption in PCB manufacturing is now widespread, yet fewer than 10% of companies have fully scaled deployments, underscoring a global gap between experimentation and factory-wide integration. For readers worldwide, the findings point to a sector where quality gains are real, but talent, data, and governance constraints are slowing broader industrial change.

Tuesday 9 June 2026

Topco monthly sales hit third-highest level on chip materials demand

Topco Scientific said strong demand from artificial intelligence and high-performance computing drove higher shipments of advanced-process materials, lifting consolidated revenue in May to NT$6.54 billion, up 18.6% year over year and the third-highest monthly level on record. For the first five months of 2026, consolidated revenue reached NT$31.85 billion, up 17.6% year over year, as semiconductor materials sales posted double-digit growth.

Tuesday 9 June 2026

Yesiang begins shipping recycled filters as 2nm demand lifts AMC market

Taiwan's Yesiang has started volume shipments of a newly certified recycled advanced micro-contamination (AMC) filter as semiconductor makers push deeper into 2nm and smaller nodes. The development could matter globally because tighter contamination control is becoming a critical yield factor for advanced chips, while cleaner manufacturing also aligns with lower-waste sourcing trends.

Tuesday 9 June 2026

Panasonic raises SP-Cap prices as AI drives passive component demand

Passive component prices are staying elevated as AI continues to drive demand, with industry sources saying pricing in 2026 will remain at high levels. Panasonic is set to launch a new round of price increases in July, mainly for its SP-Cap capacitor products, with hikes ranging from 5% to 30% depending on the specification.

Tuesday 9 June 2026

AI supply chain shortages shift from chips to equipment

As four major North American CSPs step up AI infrastructure spending, global semiconductor output forecasts keep rising. But the AI demand surge is also exposing hidden supply-chain bottlenecks, with industry watchers saying the number of components that are currently in a severe shortage now far exceeds those that are not.

Tuesday 9 June 2026

HiSilicon chip price hikes put China's AI compute supply chain back in focus

Huawei's chip design arm HiSilicon Technologies has reportedly raised prices for some products, drawing market attention as China's semiconductor sector shows signs of recovery after a prolonged downturn.

Tuesday 9 June 2026

LG Innotek expands Vietnam substrate plant as AI servers strain RF-SiP supply

LG Innotek is expanding semiconductor substrate production in Vietnam as rising demand for server components reshapes capacity across the substrate industry, fueling expectations that supply of RF-SiP substrates used in premium smartphones could tighten.

Monday 8 June 2026

Murata launches smaller MLCC for electric and automated vehicles

Murata Manufacturing said it has begun mass production of a new automotive capacitor designed to help automakers cope with shrinking circuit-board space as electrification, advanced driver-assistance systems, and autonomous driving expand worldwide. The part targets rising 48V vehicle systems, higher power demand, and tighter packaging needs across global automotive electronics markets.

Monday 8 June 2026

CWTC's May revenue hits record high as new plant targets late 2026 launch

Lead frame manufacturer Chang Wah Technology Co. (CWTC) says that as applications such as data centers, AI servers, and industrial control systems continue to grow rapidly, market demand for power management components is steadily increasing, driving growth in lead frame shipments. Demand for microcontrollers (MCUs) used in PCs, networking equipment, industrial control systems, and electric vehicles has recovered, boosting orders for QFP lead frame products. This has kept CWTC's overall capacity utilization at a high level and contributed to revenue growth.

Sunday 7 June 2026

BOE says glass-based packaging substrate pilot line has yet to reach mass-production yield

BOE Technology Group's push into glass-based packaging substrates remains short of mass production, even as the Chinese display maker expands into new materials and advanced display technologies to build growth beyond conventional panels.

Friday 5 June 2026

AI servers and MLCC recovery drive growth at Ample Electronic

As artificial intelligence fuels demand across the electronics supply chain, Taiwanese conductive paste supplier Ample Electronic is seeing a rebound in one of the industry's most overlooked segments: passive components.

Friday 5 June 2026

AI demand strains PCB supply chains, lead times stretch past 20 weeks

Explosive demand for artificial intelligence is widening supply chain bottlenecks for global electronics makers, with shortages now reaching from advanced chips and packaging into printed circuit boards, memory, and passive components. Longer lead times and rising prices are adding uncertainty for data center, optical module, and equipment buyers worldwide.

Friday 5 June 2026

US targets China's PCB grip as AI and defense supply risks mount

As demand for artificial intelligence (AI) computing expands rapidly, market attention has long centered on GPUs, high-bandwidth memory (HBM), and advanced packaging. However, printed circuit boards (PCBs), which sit beneath chips and connect critical electronics, are increasingly being viewed by the US government and defense sector as a supply chain risk.

Friday 5 June 2026

India faces PCB supply squeeze as raw material shocks, AI demand, and import dependence drive costs higher

India's PCB industry is facing mounting supply constraints and cost pressures, driven by a combination of raw material inflation, logistics disruptions, and a structural reliance on imports, according to industry associations cited by The Economic Times, as well as additional media and policy reporting.

Friday 5 June 2026

Arm says Taiwan powers its rise as agentic AI lifts PC growth

Arm CEO Rene Haas told the COMPUTEX keynote on June 2 that Taiwan has been inseparable from Arm's growth over the past 30 years, while Nvidia CEO Jensen Huang said that agentic AI will trigger the biggest PC industry transformation in 40 years and could expand the global PC market by 10 times.

Friday 5 June 2026

Hiwin targets logistics automation with Dexterity dual-arm robot

Motion control component maker Hiwin made its first cross-sector appearance at COMPUTEX 2026, showcasing a full technology stack spanning precision transmission, actuator modules, and system integration. The company also unveiled a dual-arm logistics robot developed in partnership with US logistics firm Dexterity for the first time.

Friday 5 June 2026

Hanmi Semiconductor eyes record sales in Computex debut as HBM4 demand grows

Hanmi Semiconductor is projecting record annual revenue this year, as rising demand for high-bandwidth memory equipment lifts prospects for the South Korean chip-equipment maker and gives it a prominent stage for its Computex debut.

Thursday 4 June 2026

Ventec wins spillover high-speed CCL orders, revenue rises

Ventec International said May 2026 revenue kept growing, driven by sustained demand for high-margin aerospace polyimide (PI) materials, the start of mass production after high-speed material certifications, and record-high sales of non-flow PP sheets. The copper-clad laminate (CCL) maker also benefited from strong demand for high-end drilling applications and a rising European distribution business, lifting revenue across its niche businesses.

Thursday 4 June 2026

Samsung's rumored CIS production shift highlights industry debate over fab ownership

Samsung Electronics' decision to place a key image sensor production line under its System LSI division highlights a broader question facing the CMOS image sensor (CIS) industry: whether chip designers should own manufacturing capacity or rely on external foundries as competition intensifies across smartphones, automotive systems, and AI-enabled devices.

Thursday 4 June 2026

LG Innotek targets Intel EMIB substrate chain with SK Hynix samples

LG Innotek is seeking to enter the supply chain for substrates used in Intel's EMIB advanced-packaging technology, supplying early samples to SK Hynix as it tries to move deeper into high-end semiconductor substrates, according to ZDNet Korea.

Thursday 4 June 2026

Taiwan test interface maker CHPT rides AI chip orders to record May revenue

Chunghwa Precision Test Tech. (CHPT), a supplier of semiconductor test interfaces, reported revenue in May 2026 that reached another monthly record, supported by sustained orders from major AI chipmakers as global demand for AI applications continued to rise. Overall operations in the second quarter of 2026 remained on a growth track, the company said.

Thursday 4 June 2026

AI sparks tight supply warning for high-end passive components; MLCC rally eyes new super cycle

AI-driven demand for computing infrastructure has ended the passive components industry's inventory adjustment phase, with Taiwan-based leaders Yageo and Walsin Technology both seeing utilization rates return to high or full-capacity levels. The market is now showing signs of a renewed boom for the first time since the 2018 "super cycle."

Thursday 4 June 2026

Huawei's Tau Law shifts AI chip race to glass substrates, advanced packaging

Huawei's recently proposed "Tau Law" suggests that reducing signal transmission distance, combined with heterogeneous integration and system-level optimisation, can enhance computing power and energy efficiency. The concept is increasingly seen as a key route for China to extend AI chip performance in the post-Moore's Law era.

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