As AI and high-performance computing (HPC) continue to drive semiconductor advances, industry competition is shifting beyond chip performance toward packaging, cooling, assembly, and...

TSMC will set up operations in Kaohsiung's Baipu Industrial Park, helping create Taiwan's first advanced packaging materials and equipment supply-chain cluster. Closely watched by...

As Semicon Taiwan 2026 gets underway, semiconductor test-interface structural parts maker Certain Micro Application Technology (CMAT) announced three core product lines aimed at rising...

IBM's case for quantum computing no longer rests on physics. At Semicon Taiwan 2026 on September 1, the company's argument was that AI has outrun what silicon can supply, that no amount...

Speaking at the 3DIC Global Summit at SEMICON Taiwan 2026, MediaTek general manager T.Y. Lau revealed the publicly disclosed cost structure of the B200 accelerator, saying that after...

Marvell SVP and chief technology officer Radha Nagarajan offered a clearer timeline for the commercialisation of co-packaged optics, or CPO, during a media briefing at Semicon Taiwan...

The EU is pressing ahead with the European Chips Act and discussing a second phase, but TSMC says public money alone will not secure a durable semiconductor base. The company argues...

Taiwan built the last computing era by manufacturing other people's designs. Ching-Ray Chang wants it to try the same trick with quantum computing, and he is arguing the window is...

Taiwan's semiconductor materials suppliers are seeking gains from square packaging and co-packaged optics as advanced manufacturing evolves. The changes could help local firms move...

The European semiconductor push is moving beyond factory construction toward demand, design support, and talent building, according to TSMC. For global readers, the shift matters because...

Semicon Taiwan 2026 will draw more than 1,300 companies and 4,300 booths to Taipei from September 2 to 4, setting new records as the industry show expands beyond chipmaking into packaging,...

Industry players say Taiwan's push to localize semiconductor materials did not begin in 2026. The real turning point came in 2019, when the Japan-South Korea semiconductor trade dispute...

Japan's Panasonic has raised PCB material prices for the second time in 2026, broadening the increases to copper-clad laminate (CCL), pre-preg (PP) and other products, including IC...

On the eve of the official opening of SEMICON Taiwan 2026, the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA), initiated by SEMI, TSMC, and ASE, held the 3DIC Global Summit on...