Copenhagen Infrastructure Partners (CIP) has signed a Corporate Power Purchase Agreement (CPPA) with United Microelectronics Corporation (UMC) for the development of the Fengmiao...
TSMC is leveraging strong demand for sub-7nm advanced processes and its exclusive CoWoS packaging services, emerging as the leading beneficiary of the AI boom in 2024. Despite a slow...
SpaceX and Tesla CEO Elon Musk raised concerns about chip shortages during a discussion with TSMC Chairman C.C. Wei, emphasizing the transformative potential of drones and multifunctional...
While SEMICON Japan 2024 highlighted 3DIC and advanced packaging equipment essential for artificial intelligence (AI) chips, the event saw fewer physical machinery demonstrations...
Nvidia has overcome production hurdles for its highly anticipated Blackwell chip, with CEO Jensen Huang confirming the resolution of design flaws in collaboration with TSMC. Shipments...
Amid surging AI demand, SK Hynix has unveiled a 61TB SSD tailored for AI data centers, marking a significant leap in the enterprise SSD (eSSD) market and intensifying competition...
Samsung Electronics (Samsung) is set to construct a test line for 10nm seventh-generation DRAM (1d DRAM) at Pyeongtaek Plant 2 (P2), strengthening its competitive position and enhancing...
The global wafer foundry landscape is undergoing a dramatic transformation. TSMC maintains its dominance in advanced nodes below 7 nanometers, while competitors Samsung and Intel...
On December 17, Maggie Chen, chairperson of Chenbro, which has been designated as a server case supplier for Nvidia, was invited to speak at the 12th National Science and Technology...
Samsung Electronics Co. and Texas Instruments Inc. completed final agreements to get billions of dollars of government support for new semiconductor plants in the US, cementing...
Samsung Display is advancing its microOLED technology by shifting from silicon wafers to glass substrates, a move aimed at improving production efficiency and reducing costs for AR/VR...
Merck has announced plans to invest over EUR70 million(US$72.53 million) to construct a new advanced materials development center (AMDC) at its Shizuoka site in Japan. This latest...
Kioxia, which recently listed on the Tokyo Stock Exchange (TSE), has announced plans to double its market share in AI-focused NAND products. President Nobuo Hayasaka highlighted the...
Advanced Echem Materials Company (AEMC), a specialty chemical materials supplier for semiconductors, has secured a position in a major chipmaker's supply chain and is planning capacity...
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