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Monday 16 December 2024
Samsung gears up for AI edge market with LPDDR6 samples expected by 2025
Samsung Electronics plans to introduce samples of its next-generation LPDDR6 memory by late 2025, addressing the growing demand for on-device AI solutions. The initiative aims to...
Monday 16 December 2024
Indian ESDM industry poised for rapid growth with massive market expansion
The Indian electronics system design and manufacturing (ESDM) industry was valued at approximately INR2.09 trillion (approx. US$24.62 billion) in fiscal 2023 (April 2022 to March...
Monday 16 December 2024
US tightens AI chip export rules, targets Southeast Asia as China's GPU smuggling hub
The Biden Administration is expected to unveil new regulations by the end of the year, targeting China's acquisition of advanced AI chips through third-party nations. These measures...
Friday 13 December 2024
Stellantis, CATL partner to build EUR4 bn EV battery plant in Spain
CATL and Stellantis have entered a joint venture to establish a EUR4.038 billion (approx. US$4.25 billion) battery plant in Zaragoza, Spain, with each party holding a 50% stake. As...
Friday 13 December 2024
Baidu-backed Jiyue Auto hits a wall: CEO admits challenges amid crisis
Jiyue Auto, the automotive startup co-founded by Baidu and Geely, is on the brink of collapse. CEO Joe Xia, in a letter to employees dated December 11, admitted the company faces...
Friday 13 December 2024
Supermicro partners with Nidec on water cooling CDU to enhance NVL72 cooling efficiency
Japanese company Nidec has announced its collaboration with Supermicro to develop a coolant distribution unit (CDU) for AI servers, which has already begun shipping. This new cooling...
Friday 13 December 2024
BYD expands European EV production; Gotion targets battery growth in Morocco and Slovakia
The European Union's newly imposed tariffs on Chinese electric vehicles (EVs) are sending a ripple of concern through the global auto industry. In response, BYD, the top EV manufacturer...
Friday 13 December 2024
Digital printing replaces traditional textile dyeing as Epson reshapes industry dynamics
The traditional textile industry is facing dual challenges: the loss of skilled artisanship and increasing pressure to adopt eco-friendly practices. Japan-based printer manufacturer...
Friday 13 December 2024
AI wave drives system upgrades and application demand
AI has accelerated the transformation of all industries, providing tremendous opportunities for hardware infrastructure players. However, the market is optimistic that "second phase...
Friday 13 December 2024
StreamTeck's mmWave enables accurate non-contact physiological monitoring
As the world gradually enters an era of aging populations, the demand for healthcare resources is rapidly increasing. Coupled with labor shortages caused by declining birth rates,...
Friday 13 December 2024
Speculation grows about MediaTek cutting into Apple Watch supply chain
Multiple media sources have reported that MediaTek's 5G modem chips may soon replace Intel's products in upcoming Apple Watch models. If true, it will mark MediaTek's first entry...
Friday 13 December 2024
Chinese SiC substrate firms eye overseas expansion amid domestic woes
Chinese SiC substrate vendors are seeking to expand beyond their home market where prices have collapsed amid severe oversupply, according to industry sources.
Friday 13 December 2024
China's EV exports plummet despite its market penetration rate exceeding 50% for four months
China's domestic electric vehicle (EV) sales have maintained a penetration rate of over 50% for four consecutive months, reflecting strong growth in the domestic market, according...
Friday 13 December 2024
Apple's slimmest iPhone yet may pave way for foldable devices, according to supply chain sources
Although Apple has received much flak for the lack of innovation in the external design of recent iPhones, the much-rumored iPhone 17 Air is now said to have entered the new product...
Friday 13 December 2024
TSMC to integrate CoWoS and SiPh in 2026, sources say
According to industry sources, TSMC is working to integrate CoWoS and SiPh, seeking to launch co-packaged optics (CPO) in 2026 that may inject fresh momentum into the semiconductor...