Taiwan's IC design houses are anticipating a sluggish fourth quarter in 2024 but remain hopeful for a rebound in 2025, driven by increased demand in sectors such as PCs, network communications,...
MediaTek's flagship platform, Dimensity 9400, and Qualcomm's Snapdragon 8 Gen4 are set to officially launch in October. With both products making the official transition to the 3nm...
Industry sources anticipate that the automotive sector will stay stagnant in the fourth quarter of 2024 and remain cautious about prospects in the face of unfavorable macro develop...
IC design firms are aggressively negotiating with foundry partners to achieve lower quotes for mature process manufacturing in order to alleviate cost pressure, according to industry...
As the largest beneficiary of the generative AI surge, Nvidia's dominance has attracted a wave of challengers. The recent initial public offering (IPO) filing by Cerebras signals...
The next technologies tasked with breaking through the bottleneck of Moore's Law will be silicon photonics (SiPh) and co-packaged optics (CPO). Additionally, TSMC has resumed its...
The Chinese government is reportedly intensifying efforts to discourage domestic companies from buying Nvidia AI processors, aiming to boost local suppliers like Huawei. According...
At the 2024 World Robot Conference held in late August in Beijing, Chinese companies showcased numerous humanoid robots, reflecting their enthusiasm for futuristic robotics. In contrast,...
Chung-Hsin Electric and Machinery Manufacturing (CHEM) is witnessing substantial growth driven by aggressive capacity expansion, having acquired multiple factories to boost production...
Excellence Opto. Inc. (EOI) has returned to profitability in the first half of 2024, driven by a 110% utilization rate at its Taiwan and China plants. The company is preparing for...
Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, according to SEMI. The robust spending is being driven by the regionalization...
Presently, the enhancement of AI chips' computing power heavily depends on advanced packaging technologies such as CoWoS and HBM, with the two technologies complementing each other...
According to Bloomberg, Tokyo Electron plans to recruit and train local engineers in India to support the country's growing semiconductor industry. This initiative aligns...
The ASEAN market, spanning multiple countries, has become a fiercely competitive battleground for numerous automotive and new energy vehicle (NEV) brands. In this landscape, BYD has...
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