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Wednesday 24 July 2024
Samsung unveils the ultra-thin Galaxy Z Fold6 Slim to compete with Chinese rivals
Samsung Electronics, fresh off its July 2024 launch of new foldable phones, is gearing up to introduce a sleeker, more lightweight model: the Galaxy...
Wednesday 24 July 2024
Who will benefit from a potential tariff war on chips?
With Taiwan Semiconductor Manufacturing Company (TSMC) chairman C. C. Wei promising to carry through overseas expansion plans regardless of the next US President, those securing TSMC's...
Wednesday 24 July 2024
Acer COO voices optimism about AI PCs
AI PCs are not just a passing trend, according to Acer COO Jerry Kao. He believes that AI will drive PC purchases among consumers who weren't previously considering an upgrade, as...
Wednesday 24 July 2024
Poor results from NXP raise doubt on 2H24 car chip demand
Disappointing results from NXP Semiconductors in its latest financial report may indicate that car manufacturers are becoming more conservative and the development of battery electric...
Wednesday 24 July 2024
Uncertainty arises over 3Q24 consumer chip replenishment momentum
Although initial demand for HPC and AI smartphone chips is expected to remain strong as the traditional peak season approaches, recent observations indicate potentially lower-than-expected...
Wednesday 24 July 2024
Outlook for Taiwan export orders optimistic
The prime season for the stocking of new products is rapidly approaching, and the outlook for Taiwan's export orders is optimistic, market sources believe.
Wednesday 24 July 2024
Samsung HBM3 and HBM3E still pending Nvidia quality tests
Korean media reports said Samsung Electronics's 4-generation high bandwidth memory product (HBM3) has been validated and has started mass production. However, industry sources only...
Wednesday 24 July 2024
Chinese IC self-sufficiency efforts vary for automotive MCUs, MOSFETs
China has intensified its pursuit of IC self-sufficiency, but efforts differ for automotive microcontroller units (MCUs) and MOSFETs, according to industry sources.
Wednesday 24 July 2024
TSMC said to adopt larger glass substrates for FOPLP
Glass substrates have become a critical strategic element in fan-out panel level packaging (FOPLP), a technology that TSMC and various backend houses are developing. Because of that,...
Tuesday 23 July 2024
ASML looks to expand staff in Japan thanks to rising local EUV demand
As Japan prepares to import its first-ever EUV lithography systems, ASML, the sole technology provider, plans to boost its local workforce significantly.
Tuesday 23 July 2024
YMTC head expects explosive chip demand in China amid US restrictions
A senior executive from a leading China-based NAND flash provider expressed optimism about the explosive growth potential of the Chinese semiconductor market, attributing this surge...
Tuesday 23 July 2024
IC industry hopes for turnaround in 2H24 amid new AI PC solutions
When will AI PC dividends start to pay off for the chip industry? This question has been closely followed by many in the industry during the first half of 2024. The launch of Copilot+PC,...
Tuesday 23 July 2024
Apple's rumored foldable iPhone yields mixed news for Samsung
Recent rumors suggest that Apple is conducting research and development for its first "foldable iPhone," with a potential release targeted for 2026. Industry sources believe that...
Tuesday 23 July 2024
India's latest fabless entrant iVP Semi targets domestic market with homegrown strategy
One of the newest additions to India's growing fabless startup scene is Chennai-based iVP Semi, founded by semiconductor veteran Raja Manickam. In a recent interview with Digitimes...
Tuesday 23 July 2024
Composite materials balance high potential with high costs
Composite materials are gaining significant momentum across various industries, particularly in aerospace, automotive, and offshore wind energy sectors. Renowned for their high strength,...