Samsung is stepping up its deployments in the 3D IC packaging field, looking to compete against TSMC starting 2022 for advanced chip packaging in-house, according to industry obser...

Nan Ya PCB has delivered samples of SiP substrates for processing 5nm chips for validations by clients and expects to kick off shipments of such substrates by the end of 2020 at the...

Powerchip Semiconductor Manufacturing (PSMC), the foundry subsidiary of Powerchip Technology, has announced volume production for AI memory chips using 3D wafer-on-wafer (WoW) tech...

US electric vehicle (EV) startup Canoo has attracted investments from two Taiwanese companies - touch module maker TPK Holding and passive component maker Yageo.

Automation equipment specialist Kenmec Mechanical Engineering expects to gradually ramp up shipments of its newly developed thermal solution for server rooms in the months ahead.

IBM has revealed the next generation of its POWER central processing unit (CPU) family, designed for enterprise hybrid cloud computing.

MediaTek has introduced the Dimensity 800U as the latest addition in its 5G SoC lineup. The new chipset is designed for multi-core high performance and leading 5G+5G dual Sim dual...

Samsung Electronics has announced the immediate availability of its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for today's most advanced process nodes.

Fingerprint ID chips vendor Egis Technology expects a surge in shipment pull-in from Chinese handset vendors in the third quarter of 2020, but whether this can generate a sequential...

AI adoption will be wider and inevitable for industry sectors other than software-based ones in the future, according to Andrew Ng, co-fouder of US-based online learning service provider...

Dialog Semiconductor has announced that its EcoXiP octal xSPI non-volatile memory (NVM), which was added to Dialog's portfolio through its recent acquisition of Adesto Technologies,...

Taiwan-based semiconductor material suppliers and distributors have enjoyed strong demand from their foundry clients for advanced-node manufacturing, and have seen clear order visibility...

Automotive PCB specialist Dynamic Electronics expects a faster recovery in demand for electric vehicles (EV) and automotive ADAS systems to drive up its revenues for the third quarter...

The trend towards AI at the edge and the rapid advance of machine learning algorithms have brought new application challenges to traditional video surveillance systems. As a result,...

Niche IC specialist Novatek Microelectronics is reportedly engaged in the development of AI chips for accelerating edge computing at smartphones and other devices, according to industry...