Chunghwa Precision Test Tech (CHPT) has seen strong demand in the short term for its vertical probe cards (VPCs) for processing handset APs, RF, HPC and ASIC solutions increasingly...
IC testing interfaces vendor Chunghwa Precision Test Tech (CHPT) has set up VPC (vertical probe cards) smart production lines aiming to better meet clients' expectations for delivery...
Taiwan-based HDI PCB firms including Unimicron Technology, Tripod Technology and Dynamic Electronics continue to see a ramp-up in demand for server and datacenter memory modules,...
The coronavirus pandemic is driving more companies to embrace digital transformation, but the biggest pain point in the process for many corporate CTOs is the difficulty in assessing...
Taiwan-based PCB makers are expected to see robust demand for 5G base stations, servers, networking equipment and HPC devices significantly drive up their shipments in 2020 while...
ASE Technology has entered the backend supply chain of Huawei/HiSilicon's ARM-based Kunpeng 920 server CPU, with its affiliated Siliconware Precision Industries (SPIL) set to start...
Members in the TSMC Grand Alliance have been fully assured that their revenue and profit growth momentum will not slow down in the months ahead, bolstered by the foundry's better-than-expected...
Despite rising shipments for servers, notebooks and game consoles recently due to increasing stay-at-home needs, sources from brand vendors expect the momentum for consumer-related...
Taiwan's IC testing and certification service labs have seen orders from the non-Apple camp ramp up drastically for inspecting and analyzing HPC chips demanding advanced-node manufacturing,...
Demand for high-end IC manufacturing materials remains robust with clear order visibility stretching into the third quarter of 2020, bolstered by growing adoption of advanced fabrication...
Wistron Information Technology & Sevices (ITS), a CMML (capability maturity model integration) Level 3 IT outsourcing software service provider, expects 5G, AI and IoT to drive...
Yangtze Memory Technologies (YMTC) has announced that its 128-layer 1.33Tb QLC 3D NAND flash memory chip, X2-6070, has passed sample verification on the SSD platform through co-working...
Intel is pledging an additional US$50 million in a pandemic response technology initiative to combat the coronavirus through accelerating access to technology at the point of patient...
TSMC has seen utilization of its chip-on-wafer-on-substrate (CoWoS) packaging capacity rise substantially in the second quarter of 2020, and now runs the packaging production lines...
605/681 pages
Members only
Sorry, the page you are trying to open is available only for our paid subscribers.