Taiwan's foundry industry suffered a minor sequential drop in overall revenues, better than DIGITIMES Research had originally anticipated thanks to short-term orders for electronics...

London Tech Week (LTW) 2024 held from June 10 to June 14 at the Olympia venue has come to a close, with the number of attendees tallied to be around 45,000, up from 30,000 last year...

Taiwan's IC design houses are gearing up to prepare new AI-related chip products for the second half of the year, in response to positive feedback from both enterprise and consumer...

Nvidia dominates the market for AI chips for training and deploying Large Language Models (LLMs) and its pricing power is reflected in gross margins as high as 78%, compared to competitors...

TSMC may launch a new round of price negotiations in the second half of 2024, with advanced foundry quotes expected to rise as early as 2025.

Amid the surge in AI-related chip demand and rebounding consumer device market as inventory destocking ends, demand for networking chips is yet to pick up, with low pull-in momentum...

TSMC has already received 3nm chip orders for Intel's forthcoming notebook processor series, with wafer production commencing, according to industry sources.

Microsoft and Qualcomm's limited-time collaboration on the Copilot+ PC has entered its pre-order phase, marking a significant step in bringing AI-powered PCs to the consumer market...

Energy consumption issues and the heat generated by AI training and inference computing have the semiconductor industry looking for Silicon Photonics partners such as Bay Photonics...

According to a recent Reuters report, Apple's "Apple Intelligence" technology has been rumored to use Google's Tensor Processing Unit (TPU) accelerators for early-stage training,...

At WWDC 2024, Apple announced updates for nearly every device.

These are the most-read DIGITIMES Asia stories in the week of June 10 – June 14.

Leapfrogging is no longer on Samsung's agenda at least temporarily.

High-speed transmission of AI servers has become a critical factor for major chipmakers and their supply chain partners to improve cloud computing performance, significantly driving...

Samsung Electronics is introducing the 1.4 nm process, BackSide Power Delivery Network (BSPDN), and Silicon Photonics (SiPh) technologies by 2027 to enhance its AI solution strategy...