Besides presenting the CPU, NPU, and GPU architectures and products with strategic partners, AMD CEO Lisa Su also unveiled the company's ambitious plans for 2025 and beyond in her...
Intel has announced the industry's first Glass Core Substrate (GCS) technology for next-generation advanced packaging, which has once again attracted market discussion due to the...
Taiwan's effort to build its own low Earth orbit (LEO) communication satellites has turned out to be harder than expected, as the country's electronics industry has long been geared...
From apparel manufacturers and gym businesses to emerging fashion brands, the benefits of integrating AI and ESG into their working processes are clear. This was a key focus of the...
As the Artificial Intelligence (AI) and High-Performance Computing (HPC) markets continue to rapidly grow, the semiconductor industry is racing to satisfy customer needs with advanced...
The savvy smart location tags, asset trackers, connected health sensing devices, smart home appliances, advanced vehicles, and smart electric vehicle systems show that the popularity...
Nvidia CEO Jensen Huang is currently in Taiwan engaging with local partners and suppliers, which still does not include a few key local firms such as Acer and Compal Electronics,...
This year's Computex is mostly centered on AI-enabled servers and PCs. However, while the opportunities for AI server firms are limitless, the outlook for AI PCs must be carefully...
Taiwan-based III-V compound semiconductor companies are seeking to enter the automotive supply chains, eyeing business opportunities from LiDARs, according to industry sources.
NXP launched the S32 CoreRide open platform for Software-Defined Vehicles (SDV) in March 2024. The industry is watching whether different SDV platforms will become connected or draw...
Qualcomm is gearing up for PC sales to make a comeback with its Snapdragon X series processors, which will power new AI PC models set to hit market shelves in mid-June, according...
AMD has released its roadmap for forthcoming AI accelerators until 2026, which includes the MI350, which will be manufactured utilizing TSMC's 3nm process technology.
62/1780 pages
Members only
Sorry, the page you are trying to open is available only for our paid subscribers.