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IN THE NEWS
Thursday 11 January 2024
Chinese compound semiconductor companies to fulfill domestic needs, aim overseas
Chinese companies China Resources Microelectronics (CR Micro), United Nova Technology (UNT), and SICC have been scaling their compound semiconductor business by strengthening cooperation...
Thursday 11 January 2024
Global semiconductor industry to grow in 2024, says GlobalWafers
The semiconductor environment in 2024 remains complex, beginning slowly and subsequently gaining momentum, according to Doris Hsu, chairperson for silicon wafer company GlobalWafer...
Thursday 11 January 2024
CES 2024: Panel makers showcase microLED displays
The ongoing 2024 Consumer Electronics Show has enticed panel manufacturers to bring out their best technologies and innovative applications, and MicroLED, regarded as the next-generation...
Thursday 11 January 2024
MIIT to expand auto chip national standards to 70 items by 2030
China's Ministry of Industry and Information Technology (MIIT) has announced plans to introduce the country's first set of national standards for automotive chips in 2025. The initial...
Thursday 11 January 2024
Prototype-ready Indian fabless startup aims to provide 70% of high-end features at 60% cost
A leading Indian fabless startup, which recently progressed its first chip to the prototype production stage at the foundry, plans to distinguish itself by targeting the mid-range...
Wednesday 10 January 2024
Encore! SK Hynix boasts reusable CMP breakthrough
SK Hynix has successfully developed a "grinding pad reuse technology" for Chemical Mechanical Planarization (CMP) processes. It is expected to be introduced to the production line...
Wednesday 10 January 2024
Oppo ditches chip design project, but retains Zeku architecture crew
In the era of artificial intelligence (AI), major cloud computing companies, including Google, Microsoft, Amazon, etc., are competing to invest in in-house chip design capability.
Wednesday 10 January 2024
Taiwan MCU firms upbeat about demand from new USB PD interface
The release of the USB PD 3.1 specifications has prompted Taiwanese MCU manufacturers to expedite their involvement, according to market sources.
Wednesday 10 January 2024
Navigating uncharted waters of the 'Silicon Era of Discovery'
In 1492, Queen Isabella of Spain drove out the Moors and supported Christopher Columbus in discovering the New World, evoking a pivotal moment in the Age of Discovery.
Wednesday 10 January 2024
Chinese Academy of Sciences presents 'Big Chip', leveraging RISC-V Chiplets
The Institute of Computing Technology of the Chinese Academy of Sciences recently published a paper in the journal Fundamental Research introducing their "Big Chip" archit...
Wednesday 10 January 2024
EgisTec aims to seize AI PC opportunities
AI PCs require high-speed computing that will stimulate related peripheral chip demand and specification upgrades, according to Lo Sen Chou, chairman of IC design house Egis Technology...
Wednesday 10 January 2024
Self-driving chips to be next battleground for US and Chinese vendors
Competition between US and Chinese chip vendors is heating up in the self-driving market segment, according to industry sources.
Wednesday 10 January 2024
Chip vendors tout automotive solutions at CES
Although AI applications, including AI PCs, are expected to be the focus of CES 2024, chip manufacturers such as Advanced Micro Devices (AMD), Nvidia, and Texas Instruments (TI) are...
Wednesday 10 January 2024
TSMC continues expanding CoWoS packaging capacity
TSMC continues to expand its CoWoS packaging capacity despite recent market rumors suggesting Nvidia has scaled back its orders with the foundry for 2024, according to industry sou...
Tuesday 9 January 2024
Nvidia rolls out new chips, claims leadership of AI PC race
Nvidia Corp., whose chip technology dominates in data centers used to create artificial intelligence software, announced new products to help the personal computer industry lure consumers...