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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Thursday 5 October 2023
Intel to split FPGA business, eyeing IPO for the unit in three years
Intel has gone in the opposite direction for its FPGA business compared to its peers by announcing a plan to split off its programmable chip unit in 2024. Analysts cautioned the move...
Thursday 5 October 2023
DDR5 poised to become mainstream in 2024
Major semiconductor makers are increasing available capacity for DDR5 memory, which is set to become mainstream in 2024, according to sources at memory module houses.
Thursday 5 October 2023
Chip unicorns emerge in China's Yangtze River Delta
China-based GTA Semiconductor raised CNY13.5 billion (US$1.87 billion) in financing, the latest example of a chip unicorn emerging in China's Yangtze River Delta thanks to state funds...
Thursday 5 October 2023
EDA companies gearing up for 4nm RFIC designs
Electronic design automation (EDA) companies have sped up their development of 4nm radio-frequency IC (RFIC) designs.
Thursday 5 October 2023
Rising US-China tensions affect Taiwanese IC design firms
With tensions between the US and China escalating, Taiwan-based IC design houses are under increased pressure and are becoming more cautious about doing business with Chinese customers,...
Wednesday 4 October 2023
Taiwan wafer foundry industry, 2H 2023
Taiwan's wafer foundry industry is set to generate a total of only US$77.9 billion in revenue in 2023, falling 13% from a year ago, but will see the amount to rise in 2024.
Wednesday 4 October 2023
TSMC Kumamoto fab progress on schedule, reflecting Japan's efficiency
Several suppliers have received notification from TSMC to start installing equipment at its Kumamoto fab in October. The fab may even start mass production ahead of previous plans...
Wednesday 4 October 2023
Reshaping the semiconductor landscape - generative AI, customized chips, and memory outlook in 2024
In 2024, the semiconductor sector faces pivotal shifts as demand for silicon wafers varies and global equipment spending adapts. At the forefront of these changes are innovations...
Wednesday 4 October 2023
AMD's Lisa Su: 'Economic moat' does not apply to AI industry
Previously, at the Code Conference held in California, AMD CEO Lisa Su discussed topics covering the AI industry, expansion of domestic semiconductor production in the US, Huawei's...
Wednesday 4 October 2023
DDI demand likely to remain weak in 4Q23
Due to weakening shipment pull-ins for large-size device applications, display driver IC demand is likely to remain feeble in the fourth quarter of 2023, according to industry sour...
Wednesday 4 October 2023
Chinese MCU firms eyeing AI edge device boom
Chinese MCU suppliers are actively expanding their target markets to include automotive and home AI edge device applications, looking to capitalize on the market development, according...
Wednesday 4 October 2023
Topco, UIS deny breaking US sanctions against Huawei
Two Taiwanese companies have dismissed allegations made in a recent media report that they had helped Huawei construct wafer fabs in China.
Wednesday 4 October 2023
Taiwanese PCB suppliers to see better performance in 2H23, bolstered by iPhone sales
Industry sources expect the PCB industry to be bolstered by Apple's new iPhone 15 series in the second half of the year assuming that shipments go out as planned.
Wednesday 4 October 2023
ASE intros integrated design ecosystem for advanced packaging
Advanced Semiconductor Engineering (ASE), a member of ASE Technology Holding, has announced the launch of its integrated design ecosystem (IDE), a collaborative design toolset optimized...
Wednesday 4 October 2023
A glimpse in the semiconductor equipment market trends
A recent report issued by SEMI forecast that the expenditure of global wafer foundry fabs is to decline 15% from the US$99.5 billion historical record in 2022 to US$84 billion in...