Infineon announced on Feb 16 that it has received approval from the German government to start construction of its new fab in Dresden, Germany. In addition to grants from the European...
The rising popularity of ChatGPT, an AI-powered chatbot developed by OpenAI, has encouraged Chinese chipmakers to accelerate their related GPU development.
Despite a recent surge in short-lead-time orders from customers, IC design houses have different outlooks on demand, according to industry sources in Taiwan.
The output value of Taiwan's FPD (flat panel display) industry declined 24% in 2022, according to statistics compiled by the Photonics Industry & Technology Development Association...
Display driver IC (DDI) specialist Novatek Microelectronics has entered the final stage of verification for its OLED DDIs at a South Korean panel customer who ships iPhone-use OLEDs,...
China-based AI chip startup Cambricon Technologies, already listed on the Sci-Tech Innovation Board of the Shanghai Stock Exchange, recently has been approved to issue CNY1.672 billion...
The wave of import substitution in China's semiconductor sector, coupled with the strong demand from the EV market, has led many Chinese MCU (microcontroller unit) suppliers planning...
Wafer foundries, except TSMC, reportedly are actively moving to offer price discounts for fabless clients willing to place more wafer starts for some specific processes, aiming to...
MediaTek today announced the Dimensity 7200, its inaugural chipset in the new Dimensity 7000 series. The Dimensity 7200 boasts cutting-edge AI imaging features, powerful gaming optimizations,...
Despite heavy losses in 2022, AUO is looking for opportunities to grow as a result of its ongoing technological breakthroughs and efforts to enter new markets, according to the Taiwan-based...
IC design houses have seen their China-based clients becoming enthusiastic about the resurgence of consumption brought on by China's Labor Day holiday in May and the country's 618...
Winbond has joined the UCIe (Universal Chiplet Interconnect Express) Consortium. The open industry standard defines interconnect between chiplets within a package, enabling an open...
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