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Friday 3 February 2023
Avnet expects U-shaped semiconductor recovery
The semiconductor market is expected to experience U-shaped recovery, according to Prince Yun, president of Asia Pacific at Avnet, an international IC distributor.
Friday 3 February 2023
Nexperia steps up investment in WBG semiconductors
Nexperia is stepping up its investment in wide-bandgap (WBG) semiconductors, according to Steven Lin, president of Nexperia Taiwan.
Friday 3 February 2023
MediaTek to see headwinds challenge sales in 1H23
Mobile SoC specialist MediaTek will still see headwinds from the handset market challenge its operations in the first half of 2023, according to market sources.
Friday 3 February 2023
Chinese foundries are quietly making equipment purchases
China-based foundries are buying fab tools in a low-profile manner, according to sources at semiconductor equipment suppliers.
Friday 3 February 2023
South Korea vendors to scale up OLED panel output in 2023
Samsung Display (SDC) and LG Display (LGD) will ramp up their OLED panel output in 2023 to fend off competition from Chinese rivals, according to sources at the TV supply chain mak...
Thursday 2 February 2023
Imec co-integrates high-quality SiN waveguide technology with its active silicon photonics platform
On January 31, Belgium-based semiconductor research hub Imec announced that it demonstrated co-integration of its high-quality silicon nitride waveguide technology with its silicon...
Thursday 2 February 2023
IDMs in price war for auto mmWave radar chip solutions
International IDMs are entering a new wave of price competition for their auto-use mmWave radar chips solutions, which see increasing penetration as vehicles undergo electrification,...
Thursday 2 February 2023
IC design houses to see challenging 1H23
Taiwan-based IC design houses will be caught between cutting prices to boost sales and maintaining profitability in the first half of 2023, according to industry sources.
Thursday 2 February 2023
STMicroelectronics simplifies high-efficiency two-port USB-PD adapters with ST-ONEMP digital controller
STMicroelectronics is extending its highly integrated and power-saving ST-ONE family of USB Power Delivery (USB-PD) digital controllers by introducing the ST-ONEMP, which supports...
Thursday 2 February 2023
IC design houses worst hit among Chinese semiconductor firms in 2022
Up to 41 out of 80 Chinese semiconductor firms that have released financial statements for 2022 ended the year with operating losses. IC design houses were the worst hit due to multiple...
Thursday 2 February 2023
Chipmakers see top cloud providers scale back orders
Chip orders for servers from top cloud service providers have dropped dramatically, casting a shadow over server demand prospects for 2023, according to industry sources.
Thursday 2 February 2023
IDMs promote 77GHz automotive mmWave radar chips with lower prices
IDMs are offering lower-cost 77GHz automotive millimeter wave (mmWave) radar chips, in an attempt to accelerate the transition from 24GHz to 77GHz, according to sources in the car...
Thursday 2 February 2023
TV panel prices to remain stable in February
LCD TV panel prices will likely remain stable in February, as panel makers' efforts to control capacity utilization rates have brought a healthier supply-demand balance for the display...
Wednesday 1 February 2023
Intel slashes CEO pay by 25% as part of companywide cuts
Intel Corp., struggling with a rapid drop in revenue and earnings, is cutting management pay across the company to cope with a shaky economy and preserve cash for an ambitious turnaround...
Wednesday 1 February 2023
UMC, Cadence collaborate on 3D-IC hybrid bonding reference flow
United Microelectronics (UMC) and Cadence Design Systems have jointly announced that the Cadence 3D-IC reference flow has been certified for UMC's chip stacking technologies.