SiFive successfully rolled out a portfolio of automotive CPUs based on the RISC-V standard, and is about to create a new ecosystem of chips, tier-1 auto component providers and OEM...
AMD chair and CEO Lisa Su will arrive in Taiwan in early October to meet major suppliers including TSMC and ASE Technology, according to industry sources.
The supply of industrial CPUs and microcontrollers (MCU) remains tight, with delivery lead times reaching more than 50 weeks, according to sources at industrial PC (IPC) makers.
Samsung Electronics is reportedly eyeing a closer tie with Taiwan-based United Microelectronics (UMC), already a foundry partner of the Korean tech giant, for additional OLED display...
Specialty DRAM demand for mainly consumer electronics device applications is unlikely to pick up until 2023, and may see an L-shaped recovery, according to industry sources.
Macroeconomic factors and changing investment strategy have taken their bites on China's semiconductor startups. As Financial Times reported, weakening market demand, especially...
Flexible PCB suppliers have seen demand start picking up in September, with the growth momentum mainly from shipments for recently-released new iPhones, according to market sources...
US semiconductor foundry service company GlobalFoundries (GF) has announced that it has been added to the PHLX Semiconductor Sector Index (SOX), effective Monday, September 19, 202...
At Semicon Taiwan 2022, executives from Denso, Renesas, and Infineon shed light on the major changes taking place in the automotive supply chain. Denso is one of the largest automotive...
Companies specializing in probe cards for wafer tests and load boards for final tests may see their profits erode in 2023 as chipmakers including foundry TSMC and fabless firm MediaTek...
The first smartphones supporting much faster Wi-Fi 7 connections may debut as early as the second half of 2024, according to sources at IC backend houses and inspection labs.
Taiwan-based analog IC design houses have stepped up their transition to 12-inch wafer manufacturing, and are actively developing 12-inch chip designs, according to industry source...
MediaTek is set to mass produce its new HPC chips at TSMC in 2023 using advanced process node and CoWoS (chip on wafer on substrate) packaging technology, according to backend supply...
Taiwan's IC design houses including MediaTek, Novatek Microelectronics and Realtek Semiconductor have sharply increased their new development projects for the next 1-2 years despite...
345/1811 pages
Members only
Sorry, the page you are trying to open is available only for our paid subscribers.