IC packaging materials distributors continue to see strong demand for wire-bonding operations despite uncertainties facing sales of notebooks, handsets and other end-market devices...
US chip vendors have increasingly shifted their orders away from China-based foundries to mitigate potential risks arising from the ongoing trade tensions between the US and China,...
Notebook PCB specialists HannStar Board and Global Brands Manufacture (GBM) continue to see challenges arising from an overall IC shortage, despite brisk shipments prospects for the...
China's Semiconductor Manufacturing International (SMIC) will be expanding production capacity for 28nm and above process technologies by 2024, which will considerably boost its overall...
Chances are slim for LCD TV panel prices to plunge to the cash cost level and Taiwan panel makers are now much more immune to the ongoing round of price falls amid changing industrial...
Taiwan-based OSATs expect backend shipments of 5G APs for Android handsets to decline in fourth-quarter 2021, as they moved to reduce purchases of related test sockets in early September...
China's Unisoc will see shipments of its smartphone application processors hike over 100% on year in the second half of 2021, according to Digitimes Research.
Taiwan OSATs, including ASE Technology, Greatek Electronics, Lingsen Precision Industries and Orient Semiconductor Electronics (OSE), have all begun to install additional wire-bonding...
Hangzhou Semiconductor Wafer, a silicon wafer subsidiary owned previously by Japan's Ferrotec, has closed CNY3.3 billion (US$510 million) in its Series B funding round and will be...
As the relatively mature wire-bonding technology continues to advance, it has become fully suitable for processing automotive silicon-based IGBT modules, and SiC (silicon carbide)...
Pure-play foundry United Microelectronics (UMC) saw its August revenue hit a record high for the fourth consecutive month, while revenue at fellow foundry company Vanguard International...
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