Taiwan-based Wendell Industrial, a supplier of EMC (electromagnetic compatibility) and other circuit protection components, is upbeat about its operations in the third quarter of...
IC substrate and PCB supplier Unimicron Technology has revised upward its capex target for 2021 to NT$34.47 billion (US$1.25 billion) from around NT$27 billion set previously.
PCB makers continue to see strong order momentum for notebook applications in the second half of the year, and are poised to make rolling updates to their quotes as prices of upstream...
With more mmWave-capable and HPC chip designs being developed, AiP, 3D stacking and other advanced packaging technologies will be increasingly needed for commercial applications,...
More than 50% of Apple's next-generation iPhone devices slated for launch in the latter half of 2021 reportedly will support 5G mmWave technology, according to industry sources.
AMD at the ongoing Computex 2021 talked about its 3D chipset processor developed jointly with TSMC, which provides its 3D silicon stacking and advanced packaging technologies.
Several of the world's first-tier server manufacturers has announced at Computex 2021 their new systems powered by Nvidia's BlueField-2 data processing units.
Chipmakers including Broadcom, Qualcomm and MediaTek have entered the early stages of developments for their respective Wi-Fi 7 (802.11be) chips, according to industry sources.
Taiwan-based Solar Applied Materials Technology is expected to gain new growth momentum after its new facility at Southern Taiwan Science Park (STSP) starts trial production of sputtering...
The car industry, hit hard by chip shortages, has been scrambling for foundry capacity support. UMC's latest US$3.5 billion fab expansion project has already obtained pre-payment...
Most EV startups are expected to see their growth momentum dented by the increasing difficulty in obtaining foundry capacity support for chips they need, according to industry sour...
