Taiwan-based CCL makers including Nan Ya Plastics, Iteq and Taiwan Union Technology (TUC) will raise their quotes by 15-20% starting April in response to increased costs of copper...
Japan-based semiconductor equipment vendor Tokyo Electron is reportedly eyeing the acquisition of a 6-inch wafer fab in Taiwan that has been put up on sale, while fellow companies...
Taiwan-based PCB and IC substrate companies are poised to enjoy a particularly strong first half of 2021, thanks to robust demand for high-end substrates and HDI boards, according...
Delivery lead times for analog chips including MCU and power MOSFET chips have been further extended, which will continue to boost the chip prices in the second quarter of 2021, according...
China-based PCB maker Wus Printed Circuits will see its revenue performance for 2021 hinge largely on whether demand for 5G infrastructure applications in China will rebound, according...
LCD panel prices will continue moving upward in second-quarter 2021 after making significant gains in the first quarter, as the supply remains constrained due to shortages of crucial...
In 2020, MediaTek's chipset shipments to the major smartphone OEMs reached 351.8 million units, compared to 238 million units the company supplied in 2019, according to Omdia. MediaTek's...
Apply's supply chain has started production for next-generation AirPods. Backend service supplier ASE Technology is packaging and testing optical sensors for new AirPods...
HDI PCB specialist Compeq Manufacturing expects sales growth through the third quarter of 2021, as its additional output arrives to satisfy growing end-market demand.
Pure-play foundries have raised their quotes to fair and reasonable levels, according to Frank Huang, chairman for Taiwan-based foundry Powerchip Semiconductor Manufacturing (PSMC)...
Suppliers of semiconductor components and materials, such as CCL and PCBs, have all geared up for the upcoming release of Intel's Whitley next-generation server CPU platform.
Pure-play foundry Powerchip Semiconductor Manufacturing (PSMC) broke ground for a new 12-inch wafer fab at the Tongluo campus of the Hsinchu Science Park (HSP) on March 25.
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