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Thursday 27 August 2020
US trade ban to impact China 5G smartphone AP shipments, says Digitimes Research
The US trade restrictions on Huawei are set to affect the overall shipments of 5G mobile APs to the Chinese market in fourth-quarter 2020, and to significant change the landscape...
Thursday 27 August 2020
Huawei TV business also affected by US trade ban
Huawei reportedly have reduced its components orders for TV production by 30-40%, as the US trade ban that limits the company's access to semiconductor parts has also affected its...
Thursday 27 August 2020
Ansys multiphysics solutions certified by TSMC
Ansys has achieved certification of its advanced semiconductor design solution for TSMC's CoWoS with silicon interposer (CoWoS-S) and InFO with RDL interconnect (InFO-R) advanced...
Wednesday 26 August 2020
Highlights of the day: TSMC gearing up for 2nm R&D
TSMC is set to open its R&D center for 2nm and more advanced manufacturing processes in Hsinchu in 2021, with plans to build its 2nm wafer fab nearby. TSMC has disclosed it is...
Wednesday 26 August 2020
Innolux ramping up notebook panel shipments
Innolux has seen its panel shipments for notebook applications increase significantly recently thanks to ongoing work-from-home and online learning activities in the wake of coronavirus...
Wednesday 26 August 2020
China PCB makers expanding capacity for lower-end HDI boards
China-based PCB makers have been expanding production capacities for HDI boards for lower-end handset and consumer electronics applications, but they can hardly develop significant...
Wednesday 26 August 2020
Demand for USB chips staying robust in 3Q20
Demand for USB chips has been robust and will boost Taiwan-based IC design houses' sales by over 30% both quarterly and annually in the third quarter, according to sources from the...
Tuesday 25 August 2020
STSP expects 2020 revenues growth of 15.7% on TSMC 5nm fab production
Government-developed Southern Taiwan Science Park (STSP) expects its revenues for 2020 to grow 15.7% on year to NT$860 billion (US$29.3 billion), mainly driven by TSMC ramping up...
Tuesday 25 August 2020
SiP+FPCB may be adopted for iPhone battery modules
SiP (system in package) combined with flexible PCB may be gaining ground in the supply chain of Apple devices, as the vendor reportedly will adopt the combination for its 5G handset...
Tuesday 25 August 2020
Global Wi-Fi 6E device shipments to reach 310-320 million units in 2021
Global shipments of end-market devices supporting the latest Wi-Fi 6E standards are expected to reach 310-320 million units in 2021, according to industry observers.
Tuesday 25 August 2020
Spirox, Molsentech jointly develop COVID-19 rapid test system
Taiwan-based Spirox and Molecular Sensoring Technology (Molsentech) have announced their joint development of a MOSFET-based COVID-19 rapid test system, which is slated for launch...
Monday 24 August 2020
Highlights of the day: TSMC and Samsung keen on developing packaging technology
TSMC has been devoting a lot of efforts to developing packaging technology in line with its efforts to extend the validity of Moore's Law. The foundry house's packaging...
Monday 24 August 2020
Panel makers developing OLEDoS for AR/VR, says Digitimes Research
The latest development of small- to medium-size panel technology is rapidly shifting toward AMOLED panels and related applications, including OLEDoS (OLEDon-silicon) panels for AR/VR...
Monday 24 August 2020
Taiwan IC designers to see growing pressure from China homegrown competitors
Taiwan's IC designers have benefited the most from China's de-Americanization campaign, but they will have to brace for new competition pressure from Chinese chipmakers aggressively...
Monday 24 August 2020
Semiconductor equipment supplier Trusval swings to profit
Taiwan-based Trusval Technology swung to net profits of NT$45.19 million (US$1.54 million) in the second quarter from losses in the prior quarter, with gross margin climbing 18.76pp...