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Global supply chain: Key components
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IN THE NEWS
Tuesday 7 July 2020
Global semiconductor sales increase in May
The global semiconductor industry posted May sales of US$35 billion, up 1.5% sequentially, according to Semiconductor Industry Association (SIA).
Tuesday 7 July 2020
Major Taiwan fabless firms strive for more foundry support
Taiwan's first-tier IC design houses, such as MediaTek, have demanded more capacity support from their foundry partners recently, according to industry sources.
Monday 6 July 2020
Highlights of the day: TSMC eyeing supercomputer chips
TSMC has also developed InFO_SoW (system-on-wafer) technology mainly for processing supercomputing AI chips. Demand for such extremely costly chips may be limited, but TSMC looks...
Monday 6 July 2020
PCB makers cautious about 2H20 shipments to Chinese handset vendors
Taiwan's PCB makers have turned cautious about their shipments for non-Apple handset applications in the second half of the year as most Chinese vendors have yet to give clear shipment...
Monday 6 July 2020
TSMC may commercialize InFO_SoW for supercomputer AI chips in two years
TSMC, after launching 3D SoIC backend service, has also developed InFO_SoW (system-on-wafer) technology mainly for processing supercomputing AI chips and is expected to enter commercial...
Monday 6 July 2020
TSMC fab tool suppliers see promising outlook
Taiwan-based semiconductor equipment suppliers engaged in TSMC's supply chain are set to be among the beneficiaries of the foundry house's advanced process capacity expansion with...
Monday 6 July 2020
Taiwan IC substrate makers to benefit from China locally-developed CPUs, GPUs
As demand for locally-developed CPUs and GPUs in China continues rising amid the US trade sanctions against Chinese IT enterprises, Taiwan-based IC substrate suppliers are expected...
Monday 6 July 2020
TSMC to issue NT$13.9 billion bonds to fund capacity expansion
The board of directors of Taiwan Semiconductor Manufacturing Company (TSMC) has approved plans to issue NT$13.9 billion (US$471.7 million) in unsecured bonds to help purchase new...
Friday 3 July 2020
Infineon eyes potential of e-SIM in M2M
Adoption of e-SIM technology is expected to be driven mainly by handset applications in the next few years as consumers can switch their telecom service providers easily with the...
Friday 3 July 2020
Highlights of the day: Xiaomi relies on MediaTek-customized chips
In the competitive smartphone maket, product differentiation is one of the crucial factors to attract customers. Handset vendors are now looking to customized chips to achieve such...
Friday 3 July 2020
SiC wafer in robust demand for EV applications
The supply of SiC wafers may become insufficient to satisfy demand for electric vehicles (EV) in the near future, prompting Taiwan-based silicon wafer makers including GlobalWafers,...
Friday 3 July 2020
Semiconductor equipment, material suppliers urged to invest in Taiwan
Taiwan's Ministry of Economic Affairs (MOEA) is urging international material and equipment makers to invest in Taiwan where demand for semiconductor equipment, especially from the...
Friday 3 July 2020
Prices for TV SoCs, driver ICs set to rise
Taiwan's IC designers are mulling raising quotes for TV SoCs and driver ICs amid increasingly tight supply as Korean vendors gradually quit production of LCD panels and TVs as well...
Friday 3 July 2020
E&R sees wafer-level laser cutting equipment orders surge
Taiwan-based E&R Engineering has enjoyed a surge in wafer-level laser cutting equipment orders from major chipmakers recently and also begun investing in R&D of equipment...
Friday 3 July 2020
Xiaomi, MediaTek reportedly team up for custom smartphone chips
Chinese handset vendor Xiaomi reportedly will work more closely with MediaTek to jointly develop customized SoCs for 5G smartphones after having its Redmi 10X series adopt the chipmaker's...