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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Thursday 18 June 2020
Highlights of the day: Intel, TSMC head to head in 3D packaging
Intel and TSMC are head to head in 3D packaging technology. While Intel has unveiled its Lakefield processors 3D-packaged...
Thursday 18 June 2020
Xiaomi invests in BYD Semiconductor to expand into the automotive component business
China-based Xiaomi has invested a total of CNY50 million (US$7.06 million) in a Series A+ round of financing that BYD arranged for its chipmaking affiliate BYD Semiconductor. Xiaomi...
Thursday 18 June 2020
Intel, TSMC gearing up for heterogeneous 3D IC integration
Intel has launched its first heterogeneous chip architecture made using its Foveros 3D chip stacking technology, while TSMC is looking to commercialize its SoIC (system on integrated...
Thursday 18 June 2020
Mosel, Actron team up for auto-use ULLD, IGBT components
Six-inch foundry Mosel Vitelic and diode maker Actron Technology are revving up their collaboration on diverse automotive power chips such as low loss diode (LLD), ultra LLD (ULLD)...
Thursday 18 June 2020
China, Taiwan IC designers keen on developing OLED DDI chips
Fabless chipmakers in Taiwan and China specializing in display driver ICs and fingerprint sensor chips are keenly developing OLED DDI chip solutions for smartphones seeking to build...
Thursday 18 June 2020
Nan Ya PCB looks to ABF, SiP substrates for profit growth in 2020
Nan Ya PCB will be striving to boost its profits in 2020 by focusing more on shipments of high-value products such as ABF and SiP substrates, according to company chairman CC Wu.
Wednesday 17 June 2020
EMC lands new orders for servers
CCL maker Elite Material (EMC) has gained validation from server brands and datacenter clients with their orders gradually picking up recently, according to the company.
Wednesday 17 June 2020
IC vendors to gain from strong IP camera demand through 3Q20
Chip demand for IP network camera applications has grown significantly to support remote work and education activities driven by the coronavirus pandemic, and Taiwan specialty IC...
Wednesday 17 June 2020
PCB maker Career Tech expects 3Q20 sales to follow seasonal patterns
Taiwan-based flexible PCB maker Career Technology has seen clear order visibility for the third quarter and expects its sales for the period to see a seasonal surge, according to...
Wednesday 17 June 2020
Innolux to develop smart manufacturing solutions, PLP packaging process
Innolux plans to expand its business beyond the current focus of panel manufacturing to include automation equipment and semiconductors leveraging the expertise it has gained from...
Tuesday 16 June 2020
Highlights of the day: Samsung unlikely to offer Huawei foundry support
As Huawei seeks support in the face of tightening trade sanctions from the US, speculation has emerged identifying Samsung as a likely savior who could provide foundry services or...
Tuesday 16 June 2020
Taiwan panel, touch solution providers seeing rush orders for healthcare applications
Taiwan-based flat panel makers and related touch solution providers expect demand for healthcare applications, such as those for ventilators and blood oxygen machines, to stretch...
Tuesday 16 June 2020
China car sales stimulants may prop up auto-use PCB shipments
Taiwan-based makers of automotive PCBs, after suffering significant shrinkages in shipments since 2019, now have to pin hopes on China's car sales stimulus measures to prop up their...
Tuesday 16 June 2020
GIS to see orders for tablets, notebook touch solutions last into 3Q20
Touch panel maker General Interface Solution (GIS) expects current demand for its tablet and notebook touch modules to continue into the third quarter, with expanding sales of its...
Tuesday 16 June 2020
Oppo pushes in-house development of mobile chips
Oppo is reportedly stepping up efforts to develop its own mobile application processors in house and will appropriate an annual R&D budget of over NT$20 billion (US$673.6 million)...