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IN THE NEWS
Thursday 24 October 2019
HiSilicon chips to power nearly 70% of Huawei handset shipments in 2019, says Digitimes Research
China's mobile solution provider HiSilicon Technologies is expected to see its shipments of application processors continue to grow in 2019 with its chips powering nearly 70% of handsets...
Thursday 24 October 2019
Audio to be new mainstream differentiation element for electronics devices, says Waves executive
Audio performance will become the next-wave mainstream differentiation element for consumer electronics, especially video, audio and gaming devices, according to Tomer Elbaz, executive...
Thursday 24 October 2019
Backend demand for OLED driver ICs to surge in 2020
Backend demand for OLED driver ICs is set to take off in 2020, with COP (chip on plastic) and COF (chip on film) likely to co-exist as main packaging processes, according to industry...
Wednesday 23 October 2019
Taiwan mobo makers to see ASP improvement
With Intel lowering prices for its high-end desktop Cascade Lake-X series processors and AMD set to roll out its next-generation top-end Threadripper series processors and Ryzen 9...
Wednesday 23 October 2019
Semiconductor equipment billings slip to 5-month low
Billings among North American manufacturers of semiconductor production equipment slipped below US$2 billion reaching a five-month low in September, according to SEMI.
Wednesday 23 October 2019
Out-cell touch panel demand set to shrink
Taiwan's top-2 touch panel module providers TPK Holding and General Interface Solutions (GIS) are likely to see orders for their out-cell touch solutions continue to wane, according...
Wednesday 23 October 2019
Winbond invests more in Nuvoton
Winbond Electronics has subscribed to new shares issued by Nuvoton Technology, and raised its stake in the logic IC specialist to 61.6%, according to a company filing with the Taiwan...
Wednesday 23 October 2019
Global large-size LCD panel shipment forecast, 2020 and beyond
Global large-size LCD panel shipments will fall at a negative CAGR of 0.8% 2020 through 2024 mainly due to saturated demand for TVs, monitors and AIO PCs, notebooks as well as 9-inch...
Tuesday 22 October 2019
Highlights of the day: Huawei IC design arm now top client for TSMC advanced process
The US trade ban may have affected Huawei's business, but it is apparently fueling the Chinese vendor's bid to wean itself off reliance on US technology. Its handset IC design arm,...
Tuesday 22 October 2019
Giantplus looks to greater synergy with Toppan
Taiwan-based flat panel maker Giantplus Technology looks to expand its collaboration with its parent company Toppan Printing to achieve greater synergy, according to comany sources...
Tuesday 22 October 2019
Taiwan backend supply chain ramps up support for HiSilicon 5G chips
Taiwan semiconductor backend supply chain players are poised to ramp up their shipments and revenues in line with aggressive rollout of diverse 5G chip solutions by major chipmakers,...
Tuesday 22 October 2019
HiSilicon now top TSMC customer for advanced process node
Huawei's HiSilicon has unseated Apple as the largest customer of TSMC in terms of advanced process node capacity share, according to industry sources.
Tuesday 22 October 2019
MediaTek reportedly planning 6nm 5G SoC
MediaTek reportedly has plans to roll out 6nm 5G mobile SoCs with volume production slated to kick off in the fourth quarter of 2020.
Tuesday 22 October 2019
Unisoc set to raise new funds to support 5G, IoT chips development
Tsinghua Unigroup's chipmaking arm Unisoc will enforce a capital increment of CNY5 billion (US$707.44 million) to support its development of core 5G and IoT chipsets, according to...
Tuesday 22 October 2019
VIS expects revenue surge in 2020
Vanguard International Semiconductor (VIS) will see its revenues rise sharply in 2020, thanks mainly to its acquisition of Globalfoundries' 8-inch fab in Singapore, according to Fang...