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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Friday 27 September 2019
Highlights of the day: Tight supply at TSMC, not just for 7nm
TSMC sees strong demand not just for its 7nm manufacturing node. Some of Taiwan's IC designers have reported that they have been unable to secure full support for their demand from...
Friday 27 September 2019
NAND flash storage demand to rise on 5G commercialization in 2020
NAND flash storage solutions will see much stronger demand in 2020 than 2019 driven by the commercialization of 5G networks and devices, according to Wallace Kou, president and CEO...
Friday 27 September 2019
Qualcomm striving to excel in Wi-Fi market
Qualcomm is deepening its deployment in the Wi-Fi space as demand for IoT-related transmissions is ready for a jump-start, according to Dino Bekis, the firm's vice president and mobile...
Friday 27 September 2019
More Chinese firms developing advanced-node CPUs in-house
More China-based firms have become keen on in-house development of new-generation CPUs and GPUs, allowing Taiwan IC design service providers, especially those associated with TSMC,...
Friday 27 September 2019
Toshiba Memory debuts 2nd-gen serial interface NAND
Toshiba Memory has announced the launch of a new family of SLC NAND flash memory products for embedded applications. Compatible with the widely-used serial peripheral interface (SPI),...
Friday 27 September 2019
Edge computing crucial for AI, 5G complementarity, says Qualcomm CTO
While AI and 5G technologies will closely complement each other in a variety of applications, edge computing will play the most critical role in the complementarity of both technologies,...
Friday 27 September 2019
Arm and TSMC demo 7nm Arm-based CoWoS chiplets for HPC
Arm and TSMC have announced jointly an industry-first 7nm silicon-proven chiplet system based on multiple Arm cores and leveraging TSMC's chip-on-wafer-on-substrate (CoWoS) advanced...
Friday 27 September 2019
Intel provides new Optane, 3D NAND updates
Intel has unveiled its second-generation Optane storage-class memory codenamed Barlow Pass that will be launched along with its new-generation Xeon CPUs in 2020. Intel also disclosed...
Friday 27 September 2019
Taiwan to invest more in basic research, says science minister
Taiwan's IC design ability is currently leading China by at least 10 years, but the Ministry of Science and Technology (MOST) will continue to allocate more budget for basic research...
Thursday 26 September 2019
UMC revenues to climb at least 10% in 2020
Pure-play foundry United Microelectronics (UMC) is expected to post revenue growth of at least 10% in 2020, thanks mainly to its expanded business scale in Japan, according to market...
Thursday 26 September 2019
ALi names new president
Set-top box (STB) chipset specialist ALi Tech has appointed Max Chen, an executive at MediaTek, as new president with the appointment to become effective on October 1.
Thursday 26 September 2019
Qualcomm readies solutions to address 5G mmWave tech challenges
Construction of 5G mmWave base stations has been slow worldwide except in the US due to some major challenges affecting the development of related technologies, but Qualcomm has come...
Thursday 26 September 2019
China semiconductor revenues increase 11.8% in 1H19, says Digitimes Research
Despite the global semiconductor industry's weakening demand in the first half, China's semiconductor industry continued to perform stably with sales rising 11.8% on year during the...
Thursday 26 September 2019
TSMC advises clients to book 7nm capacity for entire 2020
TSMC has advised its clients to book foundry capacity well in advance for their 7nm chip demand for the entire 2020, according to industry sources.
Thursday 26 September 2019
AMD server market share expected to break 10% in 2020
AMD's second-generation EPYC server processors have landed significant orders from major IT players such as Dell, IBM and Nokia recently, with the chip vendor standing a good chance...