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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Tuesday 4 June 2019
Semiconductor equipment billings decline in 1Q19, says SEMI
Billings among North American manufacturers of semiconductor production equipment registered both sequential and on-year decreases in the first quarter of 2019.
Monday 3 June 2019
Edge computing can maximize AI operation efficiency, says NXP executive
As smart applications cannot overly rely on cloud computing, equipping edge devices with machine learning and computing capabilities is giving rise to new market demand, but what...
Monday 3 June 2019
Infineon to acquire Cypress
Infineon Technologies and Cypress Semiconductor have announced that the companies have signed a definitive agreement under which Infineon will acquire Cypress for US$23.85 per share...
Friday 31 May 2019
Yangtze Memory to volume produce 64-layer 3D NAND chips ahead of schedule
China's Yangtze Memory Technologies (YMTC) is likely to kick off volume production of 64-layer 3D NAND flash chips ahead of schedule, as it is striving to gain orders from Huawei,...
Friday 31 May 2019
Tianma to ship flexible display panels to clients in 1H20
China-based flat panel maker Tianma Microelectronics has said it expects to begin shipping its flexible panels to clients in the first half of 2020. It is showcasing samples of its...
Friday 31 May 2019
NXP to acquire Marvell Wi-Fi connectivity business
Marvell has entered into a definitive agreement under which NXP will acquire its Wi-Fi connectivity business in an all-cash, asset transaction valued at US$1.76 billion, according...
Friday 31 May 2019
Nvidia pushing the rapidly expanding GPU computing market by extending AI inference to industries
Artificial intelligence (AI) and machine learning technologies have struggled to gain footholds in other niches to the world of cloud computing, but Nvidia is aiming to take it to...
Thursday 30 May 2019
Intel reportedly mulling outsourcing chipset design to ASMedia
Intel is reportedly considering placing chipset design orders with Taiwan IC designer ASMedia Technology, which is already a partner of AMD, as part of its efforts to fend off competition...
Thursday 30 May 2019
China overtakes Japan as world No. 2 PCB supplier
Taiwan has been the leader in the global PCB sector in terms of production value and technology development, and China has grown rapidly to unseat Japan as the world's second largest...
Thursday 30 May 2019
Unisoc rolls out new solution for TWS headsets
Unisoc has rolled out its new Bluetooth 5.0-certified solution, dubbed RDA5882, to support dual-mode BLE module designs for true wireless stereo (TWS) headsets.
Thursday 30 May 2019
Dialog intros new audio codecs to deliver active noise cancellation for wireless headphones
Dialog Semiconductor has announced the DA740x, a family of highly-integrated audio codec chips that deliver active noise cancellation (ANC) for wireless headphones.
Thursday 30 May 2019
Himax automotive display solutions adopted by BOE
Himax Technologies has launched its flexible OLED automotive display driver and timing controller for BOE Technology, according to the Taiwan-based fabless chipmaker.
Thursday 30 May 2019
SSD prices fall below US$0.10 per GB
SSD prices have fallen below US$0.10 per GB, and are expected to drop further to as low as US$0.05 per GB next year, according to China-based storage device maker Longsys Electroni...
Thursday 30 May 2019
MediaTek unveils 5G mobile SoC
At the ongoing Computex Taipei 2019, MediaTek has unveiled its new 7nm 5G SoC for flagship smartphones slated for launch in 2020.
Wednesday 29 May 2019
Taiwan IC design houses to see sales pick up in May
Taiwan-based IC design houses are expected to report impressive sales results for May, thanks to the roll-outs of their new products and a seasonal pick-up in orders for consumer...