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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Monday 23 April 2018
8-inch wafer capacity to remain tight by 2020 on explosive IoT demand
As IoT (Internet of Things) chips currently rely largely on 8-inch wafer fabs for fabrication, the increasing demand for such chips will keep such fabs in Taiwan and China running...
Monday 23 April 2018
Shipment prospects bright for TDDI, AMOLED driver ICs
The increasing popularity of all-screen and AMOLED smartphone panels will boost global shipments of TDDI (touch and display driver integration) chips and AMOLED driver ICs in 2018...
Monday 23 April 2018
IDMs, Taiwan IC firms gearing up to develop car-use SiC power devices
With silicon carbide (SiC) emerging as an increasingly popular third-generation semiconductor material for car-use power devices and 5G networks, international major IDMs such as...
Friday 20 April 2018
Phison expects to post over 10% revenue growth in 2Q18
Phison Electronics has enjoyed a pull-in of short lead-time orders for NAND flash products, and is optimistic that demand will continue to improve later in the second quarter, according...
Friday 20 April 2018
Global semiconductor packaging materials market reaches US$16.7 billion in 2017
The global semiconductor packaging materials market reached US$16.7 billion in 2017, according to a report by SEMI and TechSearch International. While slower growth of smartphones...
Friday 20 April 2018
TSMC cuts revenue outlook for 2018
Taiwan Semiconductor Manufacturing Company (TSMC) has cut its revenue growth forecast for 2018 to 10% from the previously-estimated 10-15%, citing weaker-than-expected smartphone...
Friday 20 April 2018
TI, Taiwan makers team up to develop car electronics solutions
Texas Instruments (TI) and member firms of a new generation driver platform R&D alliance set up in Taiwan three years ago have jointly developed a spate of automotive electronics...
Friday 20 April 2018
Taiwan panel makers likely to incur losses on falling panel prices
Most Taiwan-based LCD panel makers are likely to start incurring losses from the second quarter of 2018 ending their seven quarters of consecutive profit gains, as increasing output...
Friday 20 April 2018
Android phone makers to not launch 3D sensing models until 3Q18, says Digitimes Research
The world's first Android-based smartphone with 3D facial recognition technology is unlikely to hit the market until the third quarter of 2018 due to insufficient capability to integrate...
Thursday 19 April 2018
Taiwan IC designers asked to defer shipments of mining chips
Taiwan-based IC design houses have received requests from customers in the cryptocurrency mining sector to defer shipments of mining ASICs amid lackluster replacement demand for mining...
Thursday 19 April 2018
TSMC reports EPS of NT$3.46 for 1Q18
Taiwan Semiconductor Manufacturing Company (TSMC) has reported net profits of NT$89.79 billion (US$3.06 billion) for the first quarter of 2018, down 9.6% sequentially but up 2.5%...
Thursday 19 April 2018
Rising component and material costs to put pressure on gross margin
IC foundries, and PC and handset manufacturers continue to encounter rising costs of components and materials, and will see their gross margins come under downward pressure in 2018,...
Thursday 19 April 2018
Semiconductors used in electronics post solid growth in 1Q18, says IHS
Global semiconductor revenues derived from chip usage in electronic equipment and devices amounted to US$111.4 billion at the end of first-quarter 2018, up a significant 17% from...
Thursday 19 April 2018
HKC ramping LCD panel capacity aggressively
China-based Chongqing HKC Optoelectronics is expanding its capacity aggressively by announcing on April 18 that it will build a new 8.6G LCD fab, or the third one of the company,...
Thursday 19 April 2018
HannStar Display to ramp up capex for 2018
LCD panel firm HannStar Display plans to expand its capex for 2018 to between NT$3 billion (US$102.2 million) and NT$4 billion from the NT$1.9 billion spent a year earlier, with the...