After spending US$11.3 billion in semiconductor capex last year, Samsung announced that its 2017 outlays for the semiconductor group are expected to more than double to US$26 billion...

Globalfoundries (GF) and Fudan Microelectronics Group have announced they have produced a next generation dual interface CPU card, using GF's 55nm low power extended (55LPx) technology...

With flexible AMOLED panel fabs building at a quicker pace than global demand, supply capacity of flexible AMOLED panels is forecast to be 44% higher than global demand in 2018, according...

Innolux will take up Foxconn Electronics' 6G LTPS LCD fab in Luzhu, southern Taiwan for NT$31.4 billion (US$1.041 billion), a move which will ramp up its global LTPS panel market...

Nanjing is gaining momentum to become a "chip city" in China, as many semiconductor firms have newly announced plans to set up operations in its Jiangbei New Area, including China's...

The board of directors of Taiwan Semiconductor Manufacturing Company (TSMC) has approved a budget of about US$4.29 billion mainly to construct new fab facilities and expand production...

Yangtze River Storage Technology (YMTC) under the Tsinghua Unigroup has successfully developed 32-layer 3D NAND flash chips, marking a new milestone and major technological breakthrough...

Cadence Design Systems has announced that HiSilicon, a global fabless semiconductor and IC design company, has selected the Cadence Tensilica Vision P6 DSP for its 10nm Kirin 970...

WPG Holdings has reported consolidated revenues of NT$45.533 billion (US$1.51 billion) for October 2017, representing a 11.17% drop on month and 2.8% increase on year.

Synopsys has signed a letter-of-intent (LOI) with a Taiwan government-run research lab to form a strategic partnership to help the country develop an artificial intelligence (AI)...

Taiwan-based PCB maker Zhen Ding Technology is seeing strong demand in the fourth quarter of 2017 and expects the momentum to continue in the first quarter of 2018, according to company...

Qualcomm has announced that its board of directors has unanimously rejected the unsolicited proposal announced by Broadcom Limited ("Broadcom") on November 6, 2017, saying the bid...

Power discrete component supplier HY Electronic specializing in diode products has disclosed plans to acquire a 70% stake in Taiwan GPP (TGI) for NT$350 million (US$11.52 million).

Qualcomm has announced that it has signed three non-binding memoranda of understanding (MoU) wherein Xiaomi Technology, Oppo Mobile Telecommunications and Vivo Communication Technology...

The Android camp could follow the steps of Apple to temporarily suspend royalty payments to Qualcomm aiming to force the US-based chip vendors back to the negotiating table to work...