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IN THE NEWS
Monday 18 September 2017
Talent counts most in China IC development, says former SMIC CEO
The most critical key to achieving a breakthrough in the development of China's semiconductor industry rests with talent, instead of funds, markets or government policy support, according...
Monday 18 September 2017
MediaTek to unveil 5G prototype chip by end-2017
MediaTek is expected to complete development of its 5G prototype chip by the end of 2017, and is gearing up for trials of its 5G solutions in 2018, according to industry sources.
Monday 18 September 2017
SJSemi, Qualcomm announce qualification of 10nm ultra-high density wafer bumping technology
China-based SJ Semiconductor has started the qualification of 10nm ultra-high density wafer bumping for Qualcomm, according to the companies. This represents SJSemi's further improvement...
Friday 15 September 2017
Taiwan's Asia Silicon Valley plan to highlight AI, self-driving tech in 2018
After scoring impressive achievements at the end of its first implementation year in early September 2017, the Taiwan government's Asia Silicon Valley Development Plan (ASVDP) is...
Friday 15 September 2017
Nextchip licenses CEVA platform for ADAS vision system
CEVA, a licensor of signal processing IP for smart connected devices, has announced that Nextchip, a fabless company specializing in embedded vision applications for ADAS systems,...
Friday 15 September 2017
iPhone X sets new trends for smartphones
A number of new features that come along with Apple's newly released iPhone X such as 3D sensing are likely to become new standards for next-generation smartphones launched by Android-based...
Friday 15 September 2017
Marketech seeing orders swell, says report
Fab toolmaker Marketech International has seen its backlog of orders reach a record NT$13.6 billion (US$452 million), according to a recent Chinese-language Economic Daily News...
Friday 15 September 2017
M31 Technology to list on Taiwan emerging stock market
M31 Technology will start trading on the Emerging Stock Board of the Taiwan Stock Exchange (TSE) on September 20, according to the Taiwan-based silicon IP provider.
Friday 15 September 2017
Entegris expanding R&D center in Taiwan
Specialty materials provider Entegris has announced an expansion for its R&D center in Hsinchu, Taiwan. The expansion adds a new microcontamination control lab that focuses on...
Friday 15 September 2017
IC packager ASE reportedly enters Amazon supply chain
Advanced Semiconductor Engineering (ASE) has cut into the supply chain for Amazon's datacenter construction set to begin between 2017 and 2018, by providing 2.5D IC packaging services...
Friday 15 September 2017
CHPT testing solutions for 7nm chips ready for mass shipments in 2H18
IC testing solution provider Chunghwa Precision Test Technology (CHPT) expects to start mass shipments of solutions for the manufacture of 7nm chips in the second half of 2018. Shipments...
Thursday 14 September 2017
SEMICON Taiwan 2017: Brewer Science showcasing innovative materials for EUV and 3D IC manufacturing
With the semiconductor-manufacturing industry needing the high computing power that can only be achieved through advanced node logic and memory, as well as the heterogeneous-integration...
Thursday 14 September 2017
Gudeng obtains FOUP orders from China 12-inch foundries
Gudeng Precision Industrial has obtained front opening unified pod (FOUP) orders from a number of 12-inch foundries including United Semiconductor (Xiamen), Huali Microelectronics...
Thursday 14 September 2017
MediaTek to lag in advanced-node chip race
MediaTek is unlikely to roll out mobile chips built using more advanced 10nm and 7nm process technologies in 2018, as it has moved to focus on the mid-range smartphone market segment,...
Wednesday 13 September 2017
China PCB capacity expansion sharply benefits Taiwan equipment makers
Just one year after acquiring US-based flexible PCB maker Multi-Fineline Electronix (MFLX), China-based Suzhou Dongshan Precision Manufacturing is proceeding with a CNY3 billion (US$459.7...