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Tuesday 22 August 2017
China to phase in 14nm semiconductor process in 2018, says top tech master
China is proceeding with systematic deployments in 14nm semiconductor fabrication equipment, process, packaging and materials, which will be fully industrialized in 2018. And the...
Tuesday 22 August 2017
AUO, Innolux TV panel shipments to remain steady in 2H17, says report
Shipments of TV panels by AU Optronics (AUO) and Innolux will remain steady in the second half of 2017 thanks to demand from China-based TV vendors, according to a Chinese-language...
Tuesday 22 August 2017
Intel debuts 8th-generation Core CPUs
Intel announced its eight-generation processors with the first U series designed for 2-in-1 and ultra-thin notebooks on August 21. Intel will launch models for desktops in fall.
Tuesday 22 August 2017
China PCB firms step up capacity expansion
China-based PCB manufacturers including Suzhou Dongshan Precision Manufacturing (DSBJ) and Jiangxi Holitech Technology have moved to expand their production capacities eyeing a bigger...
Tuesday 22 August 2017
Qualcomm developing 3D depth sensing technology
Qualcomm is partnering with its ecosystem partners to develop 3D depth sensing technology, which will be applied to Andriod smartphones powered the Snapdragon mobile chips, according...
Tuesday 22 August 2017
Mitac to invest in India-based IT manufacturer
Mitac Holding has announced a plan to invest in India-based Infopower Technologies and will become a major shareholder of the firm. Infopower is a manufacturer of printed circuit...
Tuesday 22 August 2017
Walton net profits jump in 1H17
Memory-IC backend specialist Walton Advanced Engineering has reported net profits for the first half of 2017 reached NT$153 million (US$5.05 million), up robustly from only NT$17...
Monday 21 August 2017
Digitimes Research: Global TDDI chip shipments for 2017 to shoot up 191% on year
Global TDDI (touch and display driver integration) chip shipments for 2017 are estimated to drastically soar 191% on year due mainly to increased shipments of hybrid in-cell TDDI...
Monday 21 August 2017
Qualcomm to extend tie-up with TSMC, says executive
Qualcomm has been working with Taiwan's semiconductor firms for years, including an almost 10-year collaboration with TSMC, said Sudeepto Roy, VP of engineering for Qualcomm Technology...
Friday 18 August 2017
China market: IoT chip demand promising, says ARM CEO
Shipments of ARM-based mobile chips from China-based chipmakers have been rising rapidly along with the country's fast-growing IC design industry over the past 10 years, according...
Friday 18 August 2017
Mirle seeing order backlog swell, says report
Semiconductor and LCD panel equipment supplier Mirle Automation has seen its backlog of orders exceeding NT$10 billion (US$329.7 million), according to a recent Chinese-language Economic...
Friday 18 August 2017
Dialog looking to extend partnership with Spreadtrum
Dialog Semiconductor is looking to extend its partnership with Spreadtrum Communication, and does not rule out forming a joint venture with the China-based mobile SoC provider, said...
Thursday 17 August 2017
Micron advances semiconductor R&D capabilities with new Boise facility
Micron Technology has announced the opening of a new facility which will play a critical role in the company's research into breakthrough new memory and storage technologies of the...
Thursday 17 August 2017
Tsinghua Unigroup chief pledges firm support for Spreadtrum against mobile chip rivals
China's state-backed tech conglomerate Tsinghua Unigroup will render persistent support to its subsidiary Spreadtrum Communications to counter increasingly fierce competition in the...
Thursday 17 August 2017
China market: MediaTek to roll out new Helio P series for mid-range smartphones
MediaTek has sent out invitations for a product event to be held in Beijing on August 29, when the company will introduce its new Helio P23 and P30 series designed for mid-range smartphones,...