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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Tuesday 25 July 2017
SK Hynix delivers another quarter of record results
SK Hynix saw its revenues, operating profits and net profits reach record-high levels for the second consecutive quarter in the second quarter of 2017.
Tuesday 25 July 2017
Kinsus net profits fall 82% in 1H17
IC substrate maker Kinsus Interconnect Technology has reported net profits for the first half of 2017 declined 82.1% from a year earlier to NT$199 million (US$6.6 million). EPS for...
Tuesday 25 July 2017
MediaTek co-COO reportedly resigns
Jeffrey Ju has resigned as MediaTek's co-COO, and transitioned to become a consultant, according to media reports in Taiwan.
Tuesday 25 July 2017
MediaTek to transfer 28nm chip orders to UMC
MediaTek plans to transfer part of its 28nm mobile chip orders, including those for the Amazon Echo Dot, to United Microelectronics (UMC) from Taiwan Semiconductor Manufacturing Company...
Tuesday 25 July 2017
Facebook developing smart speaker with 15-inch touch panel
Following Amazon, Google and Apple, Facebook is also rumored to be planning to release a smart speaker product, but instead of voice recognition functionality, the company will focus...
Monday 24 July 2017
Foxconn Group increasing presence in smartphone panel market
The Foxconn Group has continued to deepen its deployment in the smartphone-use panel market and is likely to emerge as a strong player in the sector, according to industry sources.
Monday 24 July 2017
Apple sets up OLED panel R&D line in Taiwan, says report
Apple has purchased evaporators from Korea-based Sunic System to build a 2.5G OLED panel line to develop related technology and products in Taiwan, according to a Korea-based ET...
Monday 24 July 2017
On-Bright 2Q17 profits set to surge, says report
Taiwan-based On-Bright Electronics is expected to see its profits jump over 150% sequentially in the second quarter of 2017, with EPS set to exceed NT$4 (US$0.13), driven by particularly...
Monday 24 July 2017
TSMC to expand CoWoS capacity to fill increasing AI chip packaging orders
Taiwan Semiconductor Manufacturing Company (TSMC) is planning to carry out the first-ever expansion of its CoWoS (Chip on Wafer on Substrate) packaging and testing capacity to fill...
Monday 24 July 2017
Chip demand from non-Apple camp slows
Chip suppliers engaged in Apple's supply chain started to see orders pick up in June. On the other hand, chip demand from the non-Apple camp has been slow, according to sources at...
Monday 24 July 2017
Large, small LCD panel prices to polarize in 2H17
The prices of large-size and small- to medium-size panels are likely to be polarized in the second half of 2017 during which quotes for large-size panels are expected to trend downward...
Friday 21 July 2017
Chip demand for data centers to boom in China
With China's local governments looking to set up data centers, chip demand for data centers locally is set to surge, according to industry sources.
Friday 21 July 2017
Korea chipmakers looking to expand foundry biz
Samsung Electronics, Dongbu HiTek and SK Hynix have stepped up their foundry business expansions, which will as a group pose a threat to the existing major dedicated foundry houses...
Friday 21 July 2017
STMicro denies reports it will suspend taking MCU orders
STMicroelectronics has dismissed recent reports indicating the company will suspend taking orders for microcontrollers (MCU) until 2018 due to strong demand. "ST continues to manage...
Friday 21 July 2017
Four Taiwan firms file countersuit against Qualcomm
Four Taiwan-based hardware production partners of Apple, namely Foxconn Electronics, Compal Electronics, Wistron and Pegatron, have jointly filed a countersuit against Qualcomm in...