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Key components news coverage
IN THE NEWS
Friday 17 March 2017
China fabless IC firms expand global market share in 2016
While US companies still hold the largest share of fabless company IC sales, the largest fabless IC market share increase has come from China-based suppliers, according to IC Insig...
Friday 17 March 2017
DRAM designer AP Memory to buy out Zentel
Taiwan-based mobile-DRAM design specialist AP Memory Technology has announced plans to acquire the remaining 44.76% share of Zentel Electronics for NT$14.50 (US$0.47) per share. AP...
Friday 17 March 2017
Semicon China: Chipmakers talk about Moore's Law and China's fast-growing IC industry
At Semicon China 2017, executives at chip giant Intel, IC packager Advanced Semiconductor Engineering, equipment vendors ASML, Lam Research and Tokyo Electron (TEL), and nano-electronics...
Friday 17 March 2017
Mentor Graphics announces further certification of design tools for TSMC 12FFC and 7nm processes
TSMC has certified its Calibre Platform (Calibre nmDRC, Calibre Multi-Patterning, Calibre nmLVS, Calibre YieldEnhancer with SmartFill, and Calibre xACT tools), as well as the Analog...
Friday 17 March 2017
IC distributor ANStek looks to analog IC, FPGA and chip demand for national defense for 2017 growth
Answer Technology (ANStek), which distributes IC parts mainly from Analog Devices (ADI) and Xilinx, expects robust demand for analog components, FPGAs and high-profit ICs for national...
Friday 17 March 2017
Zhaoxin to roll out 16nm CPU in 2018
Shanghai Zhaoxin Semiconductor plans to introduce a 16nm 8-core 3GHz PC processor series in 2018, according to company vice president Cheng Fu.
Thursday 16 March 2017
IC demand from PC sector will not pick up until August
Taiwan-based IC design houses have said that chip orders from notebook and other PC makers have been flat in March, and a major rebound of chip orders from the PC industry may not...
Thursday 16 March 2017
MediaTek to roll out 12nm product in 2H17
MediaTek plans to roll out a new mobile SoC solution built by Taiwan Semiconductor Manufacturing Company (TSMC) using the foundry's 12nm process technology in the second half of 2017,...
Thursday 16 March 2017
China IC design industry growing
The "Made in China 2025" (MIC 2025) plan, published by the China State Council in May of 2015, has demonstrated the country's ambition to enhance its fabless IC design industry...
Wednesday 15 March 2017
Taiwan analog IC firms to post revenue growth in 1Q17
Taiwan-based analog IC firms including Anpec Electronics, Advanced Analog Technology (AAT), Global Mixed-mode Technology (GMT) and Macroblock are expected to enjoy on-year growth...
Wednesday 15 March 2017
SMIC signs license agreement for Invensas DBI technology
Semiconductor Manufacturing International (SMIC) has executed a technology transfer and license agreement for Invensas' Direct Bond Interconnect (DBI) technology, according to the...
Wednesday 15 March 2017
UMC-Synopsys collaboration speeds 14nm custom design
Synopsys and United Microelectronics (UMC) have worked together to enable Synopsys Custom Compiler and Laker custom design tools to be used with UMC's 14nm FinFET process, according...
Tuesday 14 March 2017
Samsung to ramp 7nm in 2018
Samsung Electronics demonstrated its foundry technology roadmap at the China Semiconductor Technology International Conference (CSTIC) held in Shanghai on March 12 disclosing its...
Tuesday 14 March 2017
ASE, KYEC to see sales pick up in 2Q17
IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and King Yuan Electronics (KYEC) will see their sales pick up starting in April, as shipments to their main...
Tuesday 14 March 2017
Global semiconductor equipment sales increase 13% in 2016, says SEMI
Worldwide sales of semiconductor manufacturing equipment totaled US$41.24 billion in 2016, up 13% from US$36.53 billion in 2015, according to SEMI. Total equipment bookings were 24%...