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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Wednesday 26 October 2016
Phison reports strong pre-tax earnings for 3Q16
Phison Electronics, which supplies controller solutions for memory devices, has reported pre-tax profits of NT$1.544 billion (US$48.9 million) for the third quarter of 2016, up 26.88%...
Wednesday 26 October 2016
Alchip to set up subsidiary in Hefei
Alchip Technologies, a Taiwan-based provider of ASIC/SoC design services, has signed an MoU with the Hefei city government of China's Anhui province to set up a subsidiary locally.
Wednesday 26 October 2016
ASE ready to enter volume production of fan-out wafer-level packaging
Advanced Semiconductor Engineering (ASE) has reportedly obtained orders for fan-out wafer-level packaging (FOWLP) from Qualcomm, MediaTek and HiSilicon with volume production set...
Wednesday 26 October 2016
Cadence IP tools certified on Samsung 10nm process technology
Cadence Design Systems has announced that its complete suite of digital and signoff tools has been certified for Samsung Electronics' Process Design Kit (PDK) and Foundation Library...
Tuesday 25 October 2016
AMD reports 3Q16 results
​AMD has announced revenues for the third quarter of 2016 of US$1,307 million, operating losses of US$293 million, and a net loss of US$406 million, or US$0.50 per share. Non-GAAP1...
Monday 24 October 2016
Fujitsu adopts Cadence Palladium Z1 enterprise emulation platform
Cadence Design Systems, has announced that Fujitsu has adopted the Cadence Palladium Z1 enterprise emulation platform for the development of the ARMv8-based Post-K computer. The Post-K...
Monday 24 October 2016
GMT to see VCM driver IC shipments expand significantly in 2017
Analog IC vendor Global Mixed-mode Technology (GMT) is expected to see its shipments of VCM (voice coil motor) driver ICs expand significantly in 2017 thanks to increasing adoption...
Monday 24 October 2016
Avnet completes acquisition of Premier Farnell
Avnet has announced that it has completed its acquisition of Premier Farnell in an all cash merger for GBP1.85 (US$2.26) per share, which equates to an equity value of approximately...
Monday 24 October 2016
North American semiconductor equipment industry posts September book-to-bill ratio of 1.05
North America-based semiconductor equipment manufacturers posted US$1.60 billion in orders worldwide in September 2016 (three-month average basis) and a book-to-bill ratio of 1.05,...
Monday 24 October 2016
MCU maker Nuvoton reports strong earnings for January-September
Nuvoton Technology, the logic IC subsidiary of Winbond Electronics, has reported net profits of NT$144 million (US$4.534 million) for the third quarter of 2016, down 45% on quarter...
Monday 24 October 2016
More than 30 IC design houses to vie for fingerprint sensor market in 2017
More than 30 IC design houses will vie for the growing fingerprint sensor market in 2017 due to the increasing penetration of the identification chips in the high-end smartphone segment,...
Friday 21 October 2016
Baidu adopts Xilinx to accelerate machine learning applications in the data center
Xilinx has announced that Baidu is utilizing Xilinx FPGAs to accelerate machine learning applications in their data centers in China, and the pair is collaborating to further expand...
Friday 21 October 2016
Qualcomm to return to TSMC but not for 10nm, sources claim
Taiwan Semiconductor Manufacturing Company (TSMC) is expected to win back its Qualcomm business with 7nm production, not 10nm, industry sources have claimed.
Friday 21 October 2016
StarChip security IC fabricated on HHGrace eNVM process
Shanghai Huahong Grace Semiconductor Manufacturing (HHGrace), a wholly-owned subsidiary of Hua Hong Semiconductor, and StarChip, a developer of smart card ICs, have jointly announced...
Friday 21 October 2016
Verizon launches MediaTek-powered smartphone
Verizon Wireless has launched the first-ever MediaTek-powered CDMA/LTE smartphone. The LG Stylo 2 V marks its debut as a certified smartphone chipset provider for Verizon, according...